High-heat-conductivity low-viscosity epoxy resin composite, and preparation method and application thereof

Abstract

The invention discloses a high-heat-conductivity low-viscosity epoxy resin composite, and a preparation method thereof. The epoxy resin composite comprises, by volume, 25 to 60 parts of a first spherical heat-conducting filling material, 5 to 30 parts of a second spherical heat-conducting filling material and 30 to 70 parts of epoxy resin, wherein the median particle diameter of the first spherical heat-conducting filling material is no less than 30 [mu]m, and the median particle diameter of the second spherical heat-conducting filling material is no more than 20 [mu]m. The preparation method comprises the following steps: (1) subjecting the spherical heat-conducting filling materials to vacuum drying, then successively adding epoxy resin, a curing agent and the spherical heat-conducting filling materials into a planetary centrifugal mixer and carrying out mixing and defoaming; and (2) carrying out vacuum pumping and bubble removing and then carrying out curing molding. The invention has the advantages that the spherical heat-conducting filling materials with different particle sizes and proportions are used for compounding with the epoxy resin, so the filling density of the filling materials is improved, friction between the filling materials and between the filling materials and a matrix is reduced, and the processing flowing performance of the composite is obviously improved.

Description

technical field [0001] The invention belongs to the technical field of electronic packaging materials, and relates to an epoxy resin composite material, in particular to an epoxy resin composite material with high thermal conductivity and low viscosity and a preparation method thereof. Background technique [0002] With the development of high-density assembly technologies such as LED packaging, flexible electronic components, microelectronic integration technology, and 3D packaging, the assembly density of electronic components and logic circuits has increased rapidly under the premise of shrinking in size. This development trend inevitably leads to integration. As the power of the circuit and the working heat flux continue to increase, the heat generated has also increased significantly, leading to hidden dangers such as an increase in the operating temperature of the integrated circuit, performance degradation, and hardware failure. And the key factor of long service life...

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Problems solved by technology

[0005] In view of the above defects or improvement needs of the prior art, the present invention provides a high thermal conductivity and low viscosity epoxy resin composite material, the purpose of which is to compound the epoxy resin with a spherical thermal conductivity filler with a smooth surface, and in the shearing process It can effectively reduce the friction between fillers and fillers, fillers and matrix, and improve the flow properties of composite materials. At the same time, the graded filling of spherical thermal conductive fillers with different particle sizes and volume ratios can also increase the maximum filling density of fillers and reduce the effective filling volume. Create more free volume in the matrix, reduce the movement resistance of the filler in the matrix, and further reduce the viscosity of the composite material, thereby solving the problem of poor thermal conductivity of epoxy resin composite materials under low filling conditions and processing under high filling conditions. The technical problem that the flow performance is difficult to meet the actual application requirements

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