Cured film forming resin composition

A technology of resin composition and cured film, applied in the direction of coating, etc., can solve the problems of complicated process and cost, and achieve the effect of excellent flexibility, excellent resistance and high hardness

Active Publication Date: 2019-05-07
NISSAN CHEM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, patterning by photolithography has the problem that not only the process is complicated, but also that it is costly.

Method used

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  • Cured film forming resin composition
  • Cured film forming resin composition
  • Cured film forming resin composition

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0107] [Preparation method of composition]

[0108] The method for preparing the composition of the present invention is not particularly limited. As an example, the method of dissolving (A) component in (D) solvent, mixing (B) and (C) components in a predetermined ratio in this solution in an arbitrary order to prepare a uniform solution . In addition, there may be mentioned a production method in which components (E) to (I) and other components are further added and mixed as necessary at an appropriate stage of the production method. The thus-prepared cured film-forming resin composition in a solution state is preferably used after being filtered with a filter having a pore diameter of about 0.2 µm or the like.

[0109] [Coated film and cured film]

[0110]Printing by using spin coating, flow coating, roll coating, slit coating, slit next spin coating, inkjet coating, screen printing, flexographic printing, gravure printing, offset printing, gravure offset printing, etc. ...

Embodiment 1

[0131] 41.5 g of CYCLOMER-P, 9.8 g of PET-30, 9.8 g of CYMEL303, 0.6 g of PERBUTYL L, 0.2 g of UPS, and 37.5 g of DEGEEA were charged in a 200 mL container. This was placed in a stirring device and stirred at 2,000 rpm for 10 minutes to prepare a composition (varnish).

Embodiment 2

[0133] 33.5 g of CYCLOMER-P, 11.8 g of PET-30, 11.8 g of CYMEL303, 0.5 g of PERBUTYL L, 0.2 g of UPS, and 42.2 g of DEGEEA were placed in a 200 mL container. This was placed in a stirring device and stirred at 2,000 rpm for 10 minutes to prepare a composition (varnish).

[0134] [2] Manufacture and evaluation of cured film

[0135] [2-1] Measurement of light transmittance

[0136] The varnishes of Examples 1 and 2 were respectively coated on quartz glass substrates by spin coating, and prebaked at 110°C for 2 minutes. Next, post-baking was performed at 230°C for 30 minutes to prepare a cured film with a thickness of 2 µm.

[0137] Then, the light transmittance in wavelength 400nm of each obtained cured film was measured. It should be noted that the light transmittance of the quartz glass substrate used was 93.8%.

[0138] [2-2] Evaluation of pencil hardness and adhesion

[0139] The varnishes of Examples 1 and 2 were each coated on an ITO-coated glass substrate using a ba...

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Abstract

The present invention provides a resin composition for forming a cured film, comprising: (A) a copolymer containing monomer units represented by formulas (1) and (2), (B) a melamine-based crosslinking agent, (C) a heat free Based polymerization initiator and (D) solvent. In the formula, R 1 Each independently represents a hydrogen atom or a methyl group. R 2 Represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms. R 3 represents a hydrogen atom or a methyl group.

Description

technical field [0001] This invention relates to the resin composition for cured film formation. Background technique [0002] Conventionally, protective films, insulating films, and the like required for touch panels and the like have been formed at necessary locations by patterning using photolithography using a photosensitive resin composition (Patent Document 1). [0003] However, patterning by photolithography has the problem of not only complicated steps but also high costs. Therefore, there is a demand for a composition capable of forming a protective film, an insulating film, etc. at necessary locations by a simpler method and at low cost. [0004] In addition, as shown in Patent Document 2, when an ITO film is formed by sputtering on an insulating film, cracks or the like may occur due to a stress difference between the insulating film and the ITO film. For such a protective film and an insulating film, Resistance to sputtering of ITO also becomes necessary. [0...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D133/14C08F8/14C08K5/3492C08L33/14C09D7/63
CPCC08F8/14C09D133/14C08K5/3492C08L33/14C09D7/40C09D7/63C08K5/34922C08K5/5415C08L33/04C09D133/04C08K5/10
Inventor 服部隼人
Owner NISSAN CHEM CORP
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