Frequency tripler of terahertz frequency band

Abstract

The invention relates to a frequency tripler of terahertz frequency band. The frequency tripler comprises an input signal end A, a low-pass filer B, an impedance matching circuit C, at least two diodes D, a direct current bias circuit E, an impedance matching circuit F, and an output signal end G, wherein at least two diodes D are connected in series; the input signal end A is an input end and connected with the low-pass filer B; the low-pass filter B is connected with the input end of the impedance matching circuit C, and the output end of the impedance matching circuit C is connected between two adjacent diodes D in series connection; the output end of the impedance matching circuit C is connected with the input end of the impedance matching circuit F at the same time, and the output end of the impedance matching circuit F is connected with the output signal end G; one end of the serially connected diodes D is grounded, the DC bias circuit E is connected between the ground and the diodes D, and the other end is grounded. The frequency tripler realizes the low frequency conversion loss, improves the precision, and prolongs the service life at the same time.

Description

technical field [0001] The invention relates to a frequency converter, in particular to a frequency tripler in the terahertz frequency band. Background technique [0002] In traditional microwave frequency multiplier circuit design, the influence of semiconductor device packaging parasitic parameters on circuit performance is not obvious. However, in the terahertz frequency band, the parasitic parameters generated by semiconductor device packaging have a great impact on circuit performance. It is necessary to strengthen the analysis of parasitic parameters of semiconductor device packaging and the research on the means and methods of 3D electromagnetic model construction of semiconductor device packaging, so as to realize the precise design of terahertz frequency tripler. Microstrip line is a planar circuit commonly used in microwave and millimeter wave systems Form, as the frequency rises to terahertz, the transmission loss of the microstrip line increases significantly, a...

AI Technical Summary

Problems solved by technology

However, in the terahertz frequency band, the parasitic parameters generated by semiconductor device packaging have a great impact on circuit performance.

It is necessary to strengthen the analysis of parasitic parameters of semiconductor device packaging and the research on the means and methods of 3D electromagnetic model construction of semiconductor device packaging, so as to realize the precise design of terahertz frequency tripler. Microstrip line is a planar circuit commonly used in microwave and millimeter wave systems Form, as the frequency rises to tera...

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