Method for manufacturing double-row side-by-side metallized half-holes in a circuit board

Abstract

The invention provides a method for manufacturing double-row parallel holes and metalized half holes of a circuit board. By adopting the method provided by the invention, in a production process of the double-row parallel holes and the metalized half holes, the effects of being free of burr, flashing, copper skin turnup and copper skin scratch can be achieved. And meanwhile, the invention further provides an acidic etching solution with a high copper dissolubility and a fast etching speed.

Description

technical field

[0001] The invention belongs to the technical field of circuit board processing, and in particular relates to a method for manufacturing a circuit board double-row parallel hole metallized half-hole. Background technique

[0002] In the circuit board production industry, customers require boards to sometimes have metallized half-hole designs, but the design of double-row side-by-side half-holes especially increases the difficulty in the process of circuit board production. The method of secondary drilling and milling is used to make metallized half-holes, and the phenomenon of copper skin rolling and straining of the board is particularly serious. The method of drilling first and then milling is used to make double-row side-by-side orifice plate parts. When milling metallized half holes, the copper skin at the entrance of the lower knife is in a state of no force support, and the copper skin will be involved in the hole with the rotation of the milling cutter...