Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for manufacturing double-row parallel holes and metalized half holes of circuit board

A metallized semi-hole and hole metallization technology, which is applied in the manufacture of printed circuits, printed circuits, electrical components, etc., can solve the problems of copper skin tearing, high scrap rate, and low yield of board parts, etc., to improve the etching rate , High etch factor, fast etch rate effect

Active Publication Date: 2017-03-29
HUIZHOU ZHONGJING ELECTRONICS TECH CO LTD
View PDF5 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The method of drilling first and then milling is used to make double-row side-by-side orifice plate parts. When milling metallized half holes, the copper skin at the entrance of the lower knife is in a state of no force support, and the copper skin will be involved in the hole with the rotation of the milling cutter. Burrs are formed inside or the copper skin is rolled up; when the milling cutter is worn or the parameters are set incorrectly, it is easy to cause the copper skin to tear and form holes
Drill first and then mill the metallized half-hole, and then perform high-pressure water washing before alkaline etching to clean the copper shavings and dust in the half-hole, and then perform etching. The rolled copper sheet in the hole cannot be removed by etching alone. , resulting in the need for secondary repair and scraping to form scrap, this kind of production method makes the yield rate of the board low, and the scrap rate is extremely high

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] This embodiment provides a method for manufacturing a metallized half-hole with double rows of side-by-side holes on a circuit board, which includes the following steps:

[0024] S1. Fix the positive direction of the C-side of the plate after tinning to the milling machine with positioning nails;

[0025] S2. Milling the connection position of the double-row parallel holes: Mill the connection position of the parallel hole clockwise with a milling cutter for the double-row parallel holes;

[0026] S3. Milling one-sided metallized half hole: replace the milling cutter to mill the required second drilled metallized hole into the required metallized half hole;

[0027] S4. Completion of metallized half-holes: the residual copper skin and copper scraps in the metallized half-holes completed by milling are cleaned by alkaline etching to obtain finished metallized half-holes.

[0028] In this embodiment, the connection position of the original double-row parallel holes is ch...

Embodiment 2

[0030] This embodiment provides a method for making metallized half-holes with double rows of side-by-side holes on a circuit board that is completely consistent with Embodiment 1. The difference is that in this embodiment, the etching solution used in the alkaline etching in step S4, With 10% absolute ethanol aqueous solution as solvent, including solute and each solute concentration are as follows:

[0031] Copper sulfate, 109g / L;

[0032] 10% hydrochloric acid, 178mL / L;

[0033] Polyvinylpyrrolidone, 39.3g / L;

[0034] Bank revetment agent, 4.3g / L;

[0035] Auxiliary solvent, 1.8g / L;

[0036] Wherein, the bank revetment agent is a corrosion inhibitor, and the auxiliary solvent is trimethylolpropane.

[0037] Furthermore, the corrosion inhibitor is a combination of modified phytate and polyacrylic acid, and the auxiliary solvent is 10% absolute ethanol aqueous solution.

[0038] Furthermore, the corrosion inhibitor is a combination of modified phytate and polyacrylic aci...

Embodiment 3

[0041] This embodiment provides a method for making metallized half-holes with double rows of side-by-side holes on a circuit board that is completely consistent with Embodiment 1. The difference is that in this embodiment, the etching solution used in the alkaline etching in step S4, With 10% absolute ethanol aqueous solution as solvent, including solute and each solute concentration are as follows:

[0042] Copper sulfate, 109g / L;

[0043] 10% hydrochloric acid, 178mL / L;

[0044] Polyvinylpyrrolidone, 39.3g / L;

[0045] Bank revetment agent, 4.3g / L;

[0046] Auxiliary solvent, 1.8g / L;

[0047] Wherein, the bank revetment agent is a corrosion inhibitor, and the auxiliary solvent is pentaerythritol.

[0048] Furthermore, the corrosion inhibitor is a combination of modified phytate and hydroxyethylidene diphosphonic acid, and the auxiliary solvent is 10% absolute ethanol aqueous solution.

[0049] The etching solution of this embodiment is used to etch the tinned circuit bo...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a method for manufacturing double-row parallel holes and metalized half holes of a circuit board. By adopting the method provided by the invention, in a production process of the double-row parallel holes and the metalized half holes, the effects of being free of burr, flashing, copper skin turnup and copper skin scratch can be achieved. And meanwhile, the invention further provides an acidic etching solution with a high copper dissolubility and a fast etching speed.

Description

technical field [0001] The invention belongs to the technical field of circuit board processing, and in particular relates to a method for manufacturing a circuit board double-row parallel hole metallized half-hole. Background technique [0002] In the circuit board production industry, customers require boards to sometimes have metallized half-hole designs, but the design of double-row side-by-side half-holes especially increases the difficulty in the process of circuit board production. The method of secondary drilling and milling is used to make metallized half-holes, and the phenomenon of copper skin rolling and straining of the board is particularly serious. The method of drilling first and then milling is used to make double-row side-by-side orifice plate parts. When milling metallized half holes, the copper skin at the entrance of the lower knife is in a state of no force support, and the copper skin will be involved in the hole with the rotation of the milling cutter...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/42
CPCH05K3/42H05K2203/0793
Inventor 戴晨曦李小王
Owner HUIZHOU ZHONGJING ELECTRONICS TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com