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A kind of etching solution and method for thick aluminum circuit board

An etching solution and circuit board technology, which is applied in the field of circuit board manufacturing, can solve problems such as circuit difficulties, and achieve the effect of increasing etching factor and improving linearity.

Active Publication Date: 2021-09-21
MFLEX YANCHENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, other industries use metal aluminum as the line conductor, but the thickness of the aluminum foil in this industry is relatively thin, about 10 to 30 microns. The current requires the thickness of aluminum to reach about 100 microns. It is difficult to make lines with a line width / line spacing of 200 microns / 200 microns with ordinary etching potions for etching aluminum.

Method used

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  • A kind of etching solution and method for thick aluminum circuit board
  • A kind of etching solution and method for thick aluminum circuit board
  • A kind of etching solution and method for thick aluminum circuit board

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0025] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0026] In addition, the ...

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Abstract

The invention provides an etching solution and method for thick aluminum circuit boards. The main components of the etching solution include concentrated hydrochloric acid, acetic acid, and hydrofluoric acid, and the balance is aluminum ions. The method specifically includes pressing a layer of protective film on one side of the aluminum foil, pressing a dry film on the other side of the aluminum foil, selectively exposing different positions of the dry film according to preset conditions, and removing the dry film at the unexposed position , expose the aluminum foil under the dry film, remove the exposed aluminum foil by dissolving the etching solution, remove the dry film on the aluminum foil, and obtain the desired etched thick aluminum circuit board. The present invention adopts the etching solution composed of hydrochloric acid, phosphoric acid, acetic acid and hydrofluoric acid in a certain proportion to realize thick aluminum etching, and the acetic acid and phosphoric acid added to the etching solution can effectively improve the linearity of the circuit, and the added hydrofluoric acid can improve the linearity of the circuit. The etch factor also stabilizes the etch rate by adding aluminum chloride or dissolving aluminum, making thick aluminum etch adequate for use.

Description

Technical field: [0001] The invention relates to the technical field of circuit board manufacturing, in particular to an etching solution and method for thick aluminum circuit boards. Background technique: [0002] In order to improve the safety, convenience, comfort and intelligence of automobiles, electronic systems are widely used in automobiles, such as radar, stereo camera, infrared monitoring, car audio, Internet and navigation, etc. With the country's advocacy and support for new energy vehicles and smart vehicles in recent years, the demand for circuit boards in automotive electronic components will usher in a new growth point with the outbreak of automotive electronics. Automotive electronic systems have relatively high reliability requirements for circuit boards, which must be able to operate normally within the life cycle and withstand the test of the natural environment during use. At present, a large number of automotive circuit boards on the market use copper f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/06
Inventor 刘清万克宝赵磊唐小侠
Owner MFLEX YANCHENG CO LTD
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