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a polishing pad

A polishing pad and polishing layer technology is applied in the field of polishing pads, which can solve the problems of decreased product yield, distribution of polishing liquid, irregular overall structure, etc., and achieves the effect of improving the planarization degree of wafers, improving the polishing rate and simple structure.

Active Publication Date: 2018-10-19
HUBEI DINGLONG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Unfortunately, known CMP systems and associated polishing pads are often unable to distribute the polishing fluid in this manner, resulting in uneven removal rates across the wafer surface, overall structural irregularities, unstable wafer uniformity, and reduced product yields

Method used

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Experimental program
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Embodiment Construction

[0036] First, a brief description of the polishing machine, the polishing machine platen can be rotated about its axis of rotation by means of a platen drive. A wafer may be supported by a wafer carrier and rotated about its axis of rotation. The wafer includes a polished surface that faces the polishing pad and is planarized during the polishing process. The wafer carrier may be supported by a carrier support assembly adapted to rotate the wafer during polishing and provide a downward force F to press the polished surface of the wafer 4 against the polishing pad such that the surface to be polished and the polishing pad The required pressure exists in between. The polishing machine is also equipped with a polishing fluid feeding port for delivering the polishing fluid to the polishing pad. The polishing fluid feed port should usually be placed at or near the axis of rotation of the polishing machine platen to optimize the polishing effect of the polishing pad, but this sett...

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Abstract

The invention discloses a polishing pad for solving the problems of nonuniform distribution of polishing liquid and need of further improvement of the polishing speed and the leveling degree in a traditional polishing pad. The polishing pad at least comprises a circular polishing layer; a groove for flowing the polishing liquid is formed in the upper surface of the polishing layer; the groove consists of a peripheral groove and a radial groove; the peripheral groove is a peripheral geometric center symmetry pattern with the circle center of the polishing layer as center; the edges m of the pattern are not fewer than 3; and the radial groove is a straight line or / and a curve scattered from the peripheral direction along the circle center, and has an intersecting point with the peripheral groove. The polishing pad is simple in structure, can enable the polishing liquid to uniformly distribute and flow in a polishing area, keeps uniform concentration of reactants and products in the polishing liquid in the polishing area to the greatest extent, accelerates the polishing speed, and improves the wafer planar degree.

Description

technical field [0001] The invention relates to the field of chemical mechanical polishing, in particular to a polishing pad used for polishing at least one of a magnetic base material, an optical base material and a semiconductor base material. Background technique [0002] During the fabrication of integrated circuits and other electronic devices, layers of conductive, semiconducting, and dielectric materials are deposited onto and removed from the surface of semiconductor wafers. Thin layers of conducting, semiconducting and dielectric materials can be deposited using a number of deposition techniques. Conventional deposition techniques in modern wafer processing include physical vapor deposition (PVD) (also known as sputtering), chemical vapor deposition (CVD), plasma-assisted chemical vapor deposition (PECVD), and electrochemical plating, among others. Conventional etching techniques include wet and dry isotropic and anisotropic etching, among others. As layers of mat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/26
CPCB24B37/26
Inventor 朱顺全梅黎黎
Owner HUBEI DINGLONG CO LTD
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