Multilayer substrate integration waveguide filter with high out-of-band rejection

A substrate-integrated waveguide and filter technology, applied in waveguide devices, electrical components, circuits, etc., can solve the problems of large loss, low level of out-of-band suppression, and large size, and achieve low loss and high out-of-band suppression Horizontal, compact effect

Inactive Publication Date: 2017-04-26
DFINE TECH
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  • Abstract
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  • Application Information

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Problems solved by technology

However, the ordinary single-layer single-mode substrate integrated waveguide filter has a

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  • Multilayer substrate integration waveguide filter with high out-of-band rejection
  • Multilayer substrate integration waveguide filter with high out-of-band rejection
  • Multilayer substrate integration waveguide filter with high out-of-band rejection

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Embodiment Construction

[0018] The present invention will be further described below in conjunction with the drawings and specific embodiments: figure 1 with figure 2 As shown, a multi-layer substrate integrated waveguide filter with high out-of-band suppression includes a first metal layer 1, a first dielectric layer 2, a second metal layer 3, and a second dielectric layer 4 stacked sequentially from top to bottom. , The third metal layer 5, the first, second, and third metal layers 1, 3, 5 are copper foil, the relative dielectric constant of the first and second dielectric layers 2, 4 is 2.65, and the thickness is 0.8mm; A metal layer 1 includes a circular first resonant cavity surface layer 11 and a rectangular first input / output feeder 13 connected to it. The first coupling groove 12 is etched out on the first resonant cavity surface layer 11 and is located at the first input Both sides of the output feeder line 13; the first dielectric layer 2 is rectangular, the first metallized through-hole arr...

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Abstract

The present invention provides a multilayer substrate integration waveguide filter with high out-of-band rejection. The problems are solved that the size of the current substrate integration waveguide is large, the level of the out-of-band rejection is not high, and the loss is still large. The filter comprises in order from up to down comprises a first metal layer (1), a first dielectric layer (2), a second metal layer (3), a second dielectric layer (4) and a third metal layer (5) which are stacked. The materials of the first metal layer (1), the second metal layer (3) and the third metal layer (5) are copper or sliver or tin or the composite layer formed by two types of metal mentioned above, namely the substrate metal is plated with another metal layer, and the first dielectric layer (2) and the second dielectric layer (4) can be common high-frequency circuit substrate and also can be the substrate though LTCC sintering or a semiconductor substrate. The multilayer substrate integration waveguide filter with the high out-of-band rejection can be configured to allow a transmit-receive front end to filter interference signals, and is good in the out-of-band rejection, small in loss and small in size.

Description

[0001] Technical field: [0002] The invention belongs to the technical field of microwave and millimeter wave passive devices, and particularly relates to a substrate integrated waveguide filter in a microwave and millimeter wave passive device. [0003] Background technique: [0004] The filter is one of the key components of the radio frequency transceiver front end, which is widely used in radar and communication systems. In recent years, with the continuous improvement of the miniaturization and high integration requirements of these systems, higher requirements have been put forward for the performance of the filter, such as insertion loss, out-of-band suppression, and size. Current filters are mainly composed of microstrips and cavities. Microstrip filters have high loss and low power capacity, while cavity filters have low loss, but are bulky and heavy. The substrate integrated waveguide is a structure between the microstrip and the cavity, which combines the advantages of t...

Claims

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Application Information

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IPC IPC(8): H01P1/208
CPCH01P1/2082
Inventor 程飞张义林张敏徐克兴
Owner DFINE TECH
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