Accelerated test method for anti-PID performance of packaging adhesive film of photovoltaic assembly

A photovoltaic module packaging and testing method technology, applied in the monitoring of photovoltaic systems, photovoltaic power generation, photovoltaic modules, etc., can solve the high requirements for aging and testing equipment, accelerated testing methods for packaging film anti-PID performance, packaging film The characterization of the anti-PID performance is not convenient and fast enough to achieve the effect of saving test cost and time

Active Publication Date: 2017-05-10
HANGZHOU FIRST APPLIED MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, at present, there is no accelerated test method for the anti-PID performance of photovoltaic module packaging film at home and abroad.
Although the component PID test method can be used to characterize the encapsulation film, it is generally necessary to package the battery sheet to prepare a large component with a conventional size, and test the IV curve and EL photo of the component before and after the PID experiment. The requirements are high, and the required equipment is relatively expensive, and the characterization of the anti-PID performance of the packaging film is not convenient and fast enough.

Method used

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  • Accelerated test method for anti-PID performance of packaging adhesive film of photovoltaic assembly
  • Accelerated test method for anti-PID performance of packaging adhesive film of photovoltaic assembly
  • Accelerated test method for anti-PID performance of packaging adhesive film of photovoltaic assembly

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] (1) Use conventional EVA film and anti-PID EVA film to encapsulate the same batch of P-type polysilicon cells with a refractive index of 2.08 respectively, and make two small photovoltaic modules containing 36 cells;

[0025] (2) After shading the front of each module, use a constant current source to connect the positive pole and negative pole of the module, pass a constant current of 1A, 3A and 15A in each module in turn, record the voltage value displayed by the constant current source under each current, as initial data V 0 ;

[0026] (3) Paste conductive aluminum foil on the glass surface of the module;

[0027] (4) Under the conditions of 85°C, 85%RH, and -2000V bias voltage, conduct a PID 48h test on the module;

[0028] (5) After shading the front of each component, use a constant current source to connect the positive and negative poles of the component, pass a constant current of 1A, 3A and 15A in each component in turn, and record the voltage value displaye...

Embodiment 2

[0033] (1) Encapsulate the same batch of N-type monocrystalline cells of the same type with anti-PID EVA film and conventional cross-linked PO film respectively, and make two small photovoltaic modules containing one cell;

[0034] (2) After shading the front of each module, use a constant current source to connect the positive and negative electrodes of the module, pass a constant current of 5A in each module, record the voltage value displayed by the constant current source under each current, and use it as the initial data V 0 ;

[0035] (3) Paste conductive aluminum foil on the glass surface of the module;

[0036] (4) Under the conditions of 121°C, 100% RH, and +2000V bias voltage, conduct a PID 1h test on the module;

[0037] (5) After shading the front of each module, use a constant current source to connect the positive and negative electrodes of the module, pass a constant current of 5A in each module in turn, record the voltage value displayed by the constant curren...

Embodiment 3

[0042] (1) Encapsulate the same batch of crystalline silicon heterojunction HIT cells with conventional cross-linked PO film and anti-PID enhanced cross-linked PO film to make two small photovoltaic modules containing 4 cells;

[0043] (2) After shading the front of each module, use a constant current source to connect the positive and negative electrodes of the module, pass a constant current of 0.01A, 0.5A and 2A in each module in turn, and record the voltage displayed by the constant current source under each current value, as the initial data V 0 ;

[0044] (3) Paste conductive aluminum foil on the glass surface of the module;

[0045] (4) Under the conditions of 60°C, 85% RH, and -600V bias voltage, conduct a PID 96h test on the module;

[0046] (5) After shading the front of each module, use a constant current source to connect the positive and negative electrodes of the module, pass a constant current of 0.01A, 0.5A and 2A in each module in turn, and record the voltag...

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Abstract

The invention discloses an accelerated test method for the anti-PID performance of a packaging adhesive film of a photovoltaic assembly. The method includes the following steps: utilizing a packaging adhesive film to package and make a miniature solar photovoltaic assembly; shading the front side of the assembly, connecting an anode of the assembly with a cathode of the assembly through a constant current source, enabling constant current to be switched on inside the assembly, and recording a voltage value displayed by the constant current source; attaching conductive metal foil on a glass side of the front side of the assembly, conducting a 1h-96h PID test on the assembly in conditions of high temperature, high moisture and offset voltage application, switching on the constant current inside the assembly through the constant current source, and recording a voltage value displayed by the constant current source; and finally obtaining a voltage drop proportion. The anti-PID performance of the packaging adhesive film is determined in a way that the constant current is made to be switched on inside the assembly to test voltage drops. Assembly manufacturing and procedures before and after PID tests are simplified, requirements of test equipment are reduced, the test cost and time is saved, and the method has guiding significance for optimization of anti-PID packaging adhesive film formulas and manufacturing techniques.

Description

technical field [0001] The invention relates to the field of solar cell modules, in particular to an accelerated test method for anti-PID performance of a photovoltaic module packaging adhesive film. Background technique [0002] With the vigorous development of the photovoltaic industry, more and more photovoltaic power plants have been built and put into use around the world. However, during the operation of the power station system, some problems affecting the normal power generation of the components were gradually discovered. Among them, the Potential Induced Degradation (PID) effect of crystalline silicon photovoltaic modules has attracted the most attention, and the degree of module power attenuation caused by this phenomenon is relatively serious. At present, major component companies have developed anti-PID cells and released anti-PID component products, and encapsulation film manufacturers have also launched anti-PID encapsulation film products. [0003] Chinese ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02S50/10
CPCH02S50/10Y02E10/50
Inventor 桑燕罗坤邵佳俊侯宏兵周光大
Owner HANGZHOU FIRST APPLIED MATERIAL CO LTD
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