Wire-cutting method of crystalline silicon

A technology of crystalline silicon and wire cutting, which is applied to fine working devices, stone processing equipment, manufacturing tools, etc., can solve the problems that the contribution of increasing production and reducing costs cannot meet expectations, the total thickness and deviation of intermittent line marks, etc., and achieve Reduce impurity disconnection, increase slicing capacity, and reduce energy consumption

Inactive Publication Date: 2017-05-31
YANGZHOU RONGDE NEW ENERGY TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] Based on this, corrugated steel wires, spiral steel wires and structural steel wires have been gradually developed in the industry to improve the ability of steel wires to carry sand according to local conditions. , if there is no matching cutting process, intermittent line marks or TTV (total thickness deviation) abnormalities are prone to occur in multi-wire cutting, and the contribution to speed increase, production increase and cost reduction is far below expectations

Method used

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  • Wire-cutting method of crystalline silicon
  • Wire-cutting method of crystalline silicon
  • Wire-cutting method of crystalline silicon

Examples

Experimental program
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Embodiment 1

[0058] Crystalline silicon wafers are produced in the following steps.

[0059] (1) Prepare new mortar: polyethylene glycol (viscosity 45mPa s and new 1500# silicon carbide particles are mixed with a sand-liquid mass ratio of 1.02 to prepare a new mortar, and the density of the new mortar is 1.675kg / L, The viscosity is 240mpa s;

[0060] (2) Preparation of regenerated mortar: the waste mortar is removed through a centrifugal separation device to remove the fine powder particles, the waste liquid is filtered and purified, and then the treated sand liquid is mixed to prepare a regenerated mortar with a density of about 1.675Kg / L. Because the processing process is basically a physical method, the viscosity of the liquid (240mPa·s) remains basically unchanged.

[0061] (3) Prepare online mortar: take 20% by weight of new mortar + 80% by weight of recycled mortar, mix and stir evenly for use, and ensure that the density is 1.675kg / L and the viscosity is 240mPa·s.

[0062] (4) Pro...

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Abstract

The invention relates to a wire-cutting method of crystalline silicon. The wire-cutting method adopts online mortar and a structure wire for cutting, cutting speed and cutting efficiency are improved effectively, yield is increased, cost of auxiliary materials like mortar is lowered, and slice profitability is improved.

Description

technical field [0001] The present invention relates to the technical field of crystalline silicon solar cells, and more particularly, relates to a method for wire-cutting crystalline silicon. Background technique [0002] With the development of society, the solar photovoltaic industry has gradually become a new leading industry. In the production process of solar silicon wafer wire cutting, the steel wires commonly used in the industry for cutting silicon wafers are mainly ordinary straight steel wires with circular or elliptical cross-sections. Mortar cutting technique for ordinary straight steel wire. A large amount of mortar needs to be invested, the cutting speed is slow, the output is low, and the cost is high. When cutting the silicon block, the silicon carbide particles lack adhesion and are easy to fall off from the surface of the steel wire. The steel wire will cause the splash of the slurry at the entrance of the silicon block , thereby reducing the mortar carr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/04
CPCB28D5/04
Inventor 崔三观程正景杨恒韩秋生
Owner YANGZHOU RONGDE NEW ENERGY TECH
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