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Heat-conducting sticking silica gel

A silica gel, bonding technology, applied in the direction of adhesives, polymer adhesive additives, non-polymer adhesive additives, etc., can solve the problems of excessive heat, insufficient adhesion, and overall performance degradation of the device, and achieve anti-precipitation. Good performance, improve adhesion, reduce the effect of poisoning

Active Publication Date: 2017-05-31
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage is that toluene is harmful to the human body and is not environmentally friendly. Due to the volatilization of toluene (the boiling point of toluene is 110°C), the cured sample may have some cavities, and there will be gaps between the heat transfer powders, causing heat transfer interruptions, resulting in The heat of the device is highly concentrated, causing local overheating of the device, and even burning the device
The fluidity of the solvent-free type is not good enough, which leads to inconvenient operation and affects the use
At the same time, both of these two kinds of silica gel are slightly poisoned, which makes the glue not fully cured, resulting in a decline in the overall performance of the product; there is also insufficient adhesive force provided by the silica gel, and there is a phenomenon of falling off during later use.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] At 25 ° C, first weigh the viscosity of 20000mPa.s such as structural formula (1), where R 1 for-Vi, R 2 100g of -Me methyl vinyl silicone oil (vinyl content is 0.1wt%), viscosity is 5000mPa.s such as structural formula (1), wherein R 1 for-Vi, R 2 Be -Vi methyl vinyl silicone oil (vinyl content is 5wt%) 100g; Viscosity is 50g of diluent of 10mPa.s, joins in the 2L kneader, weighs the aluminum oxide powder 300g that particle diameter is 5 μm to join then In the kneader, stir at a low speed for 10 minutes, then continue to add 300 g of alumina powder with a particle size of 5 μm, stir at a low speed for 10 minutes, and finally add 140 g of alumina powder with a particle size of 5 μm; stir at a low speed for 10 minutes, increase the speed of the kneader , turn on the heating at the same time, set the temperature to 150°C, mix for 2 hours after reaching the temperature, and finally stir for 10 minutes under a vacuum of 0.8MPa, put the base material into a sealed barrel w...

Embodiment 2

[0035] At 25 ° C, first weigh the viscosity of 20000mPa.s such as structural formula (1), where R 1 for-Vi, R 2 Be -Vi methyl vinyl silicone oil (vinyl content is 0.1wt%) 150g, viscosity is 5000mPa.s such as structural formula (1), wherein R 1 for-Vi, R 2 Be-Me methyl vinyl silicone oil (vinyl content is 5wt%) 40g; Viscosity is 60g of diluent of 10mPa.s; Join in the 2L kneader, then take by weighing 300g of the aluminum oxide powder that particle diameter is 20 μm joins In the kneader, stir at a low speed for 10 minutes, then continue to add 300 g of alumina powder with a particle size of 20 μm, stir at a low speed for 10 minutes, and finally add 130 g of alumina powder with a particle size of 20 μm; stir at a low speed for 10 minutes, increase the speed of the kneader , turn on the heating at the same time, set the temperature to 150°C, mix for 2 hours after reaching the temperature, and finally stir for 10 minutes under a vacuum of 0.8MPa, put the base material into a seal...

Embodiment 3

[0038] At 25 ° C, first weigh the viscosity of 10000mPa.s such as structural formula (1), where R 1 for-Vi, R 2 190g of methyl vinyl silicone oil (vinyl content is 3wt%) for -Vi; 40g of diluent with a viscosity of 50mPa.s; join in a 2L kneader, and then weigh 250g of alumina powder with a particle diameter of 5 μm. Add 50g of alumina powder with a diameter of 20μm into the kneader, stir at low speed for 10 minutes, then continue to add 300g of alumina powder with a particle size of 20μm, stir at a low speed for 10 minutes, and finally add alumina powder with a particle size of 20μm 150g; Stir at low speed for 10 minutes, increase the speed of the kneader, turn on the heating at the same time, set the temperature to 150°C, mix for 2 hours after reaching the temperature, and finally stir for 10 minutes under a vacuum of 0.8MPa, and take the base material out to the sealed container while it is hot. In barrels, sealed and stored for later use;

[0039] Take by weighing above-me...

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PUM

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Abstract

The invention relates to heat-conducting sticking silica gel. The heat-conducting sticking silica gel is prepared from the following raw materials in parts by weight: 98 to 99 parts of a matrix, 0.7 to 1.2 parts of a cross-linking agent, 0.27 to 0.6 part of an adhesive, 0.01 to 0.1 part of an inhibitor and 0.02 to 0.1 part of a catalyst, wherein the matrix is prepared by sequentially adding methyl vinyl silicone oil, a diluting agent and heat-conducting filling into a kneading machine at the weight ratio of (19 to 21) to (4 to 6) to (73 to 75), wherein the heat-conducting filling needs to be added for a plurality of times; the heat-conducting filling is stirred for a period of time at a low speed; after the powder is completely mixed into the silicone oil, the rotary speed of the kneading machine is improved; meanwhile, a heating function is started and the temperature is set to be 150 DEG C; after the temperature is reached, the materials are mixed for 2h; finally, a mixture is stirred for 10min under the vacuum degree of 0.8MPa; the matrix is poured into a sealing bucket when the matrix is hot, and then the sealing bucket is sealed and a product is preserved for later use.

Description

technical field [0001] The invention relates to a thermally conductive silica gel, in particular to a concentrating solar aluminum sheet bonding silica gel with medium thermal conductivity, medium strength, high adhesiveness, anti-poisoning and good thixotropy, belonging to the field of organic silica gel adhesives. Background technique [0002] At present, the concentrating solar heat conduction silica gel on the market is divided into solvent type and solvent-free type. The solvent type is mainly added with toluene, and the addition of solvent is mainly to increase the fluidity. The disadvantage is that toluene is harmful to the human body and is not environmentally friendly. Due to the volatilization of toluene (the boiling point of toluene is 110°C), the cured sample may have some cavities, and there will be gaps between the heat transfer powders, causing heat transfer interruptions, resulting in The heat of the device is concentrated too much, causing local overheating ...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J11/08C09J11/04C09J11/06
CPCC08K2201/003C08L2203/20C08L2205/025C09J11/04C09J11/06C09J11/08C09J183/04C08L83/04C08K9/00C08K2003/2227
Inventor 孙刚陈维
Owner YANTAI DARBOND TECH
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