Single-chip high-precision temperature and humidity sensor

A technology of temperature and humidity sensor and humidity sensor, which is applied in the direction of instruments, thermometers, scientific instruments, etc., can solve the technical error of the integration scheme of the single-chip temperature and humidity sensor, can not really reflect the temperature and other problems, and achieve the reduction of technical error, thin thickness, small area effect

Active Publication Date: 2017-05-31
SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT
View PDF7 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the above-mentioned traditional temperature and humidity sensor chip, the actual bottom temperature senses the substrate temperature, which will be mainly affected by the chip substrate temperature, PCB board temperature, etc., so it cannot really reflect the temperature in the external humidity environment
[0006] At the same time, the test value of the existing temperature and humidity sensor for relative humidity is directly related to the temperature value in the humidity environment, such as figure 1 As shown, in the relative humidity-temperature (Relative Humidity-Temperature) relationship curve obtained through the temperature and humidity sensor test, there is a gap between the temperature value corresponding to the ordinate and the actual temperature value in the humidity environment marked in the box above the curve. big difference
[0007] Therefore, there are large technical errors in the existing single-chip temperature and humidity sensor integration scheme

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Single-chip high-precision temperature and humidity sensor
  • Single-chip high-precision temperature and humidity sensor
  • Single-chip high-precision temperature and humidity sensor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] The specific embodiment of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0030] It should be noted that, in the following specific embodiments, when describing the embodiments of the present invention in detail, in order to clearly show the structure of the present invention for the convenience of description, the structures in the drawings are not drawn according to the general scale, and are drawn Partial magnification, deformation and simplification are included, therefore, it should be avoided to be interpreted as a limitation of the present invention.

[0031] In the following specific embodiments of the present invention, please refer to figure 2 , figure 2 It is a structural schematic diagram of a single-chip high-precision temperature and humidity sensor in the first preferred embodiment of the present invention. Such as figure 2 As shown, a single-chip high-precision temperature and humidi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a single-chip high-precision temperature and humidity sensor. A heat conduction channel layer is arranged on the top of a chip and serves as a temperature sensitive resistor of a temperature sensor to perceive temperature of external environments, temperature influence caused by a substrate, a PCB (printed circuit board) connected with the substrate and the like can be avoided when the temperature sensitive resistor perceives the temperature of the external environments, so that the temperature under the external humidity can be accurately reflected, and technical errors can be greatly reduced when the single chip is integrated. The temperature and humidity sensor is integrated onto a shared substrate in an embedded manner and shares a forked capacitance electrode plate, so that the temperature and humidity sensor has a smaller area and suitable for manufacture of needlelike sensors, the temperature and humidity sensor is parallelly integrated onto the shared substrate, so that the temperature and humidity sensor can be thinner and is suitable for manufacture of thin sensors, and the temperature and humidity sensor can be widely applied to occasions of different specific requirements.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing, and more specifically, to a high-precision temperature and humidity sensor integrated on a single chip. Background technique [0002] Traditional single-chip temperature and humidity sensors usually use CMOS circuits to make temperature sensor circuits based on bandgap (band gap), but this circuit structure has low detection accuracy for temperature. [0003] Since the above-mentioned temperature sensor circuit is fabricated on the chip substrate and integrated with the substrate, it has thermal conduction performance, so that the external temperature can be conducted to the sensor circuit through the metal arranged at the bottom of the substrate to sense the temperature; and the chip The humidity sensor on the substrate is made on the top of the substrate, for example, the currently commercially available Sensirion (Sensirion) temperature and humidity sensor model SHTC1. [000...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G01D21/02G01K7/16G01N33/00
CPCG01D21/02G01K7/16G01N33/00
Inventor 康晓旭
Owner SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products