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Pressure sensor and production method thereof

A pressure sensor and substrate technology, applied in the field of sensors, can solve the problems of small pressure detection range and achieve the effects of low cost, sensitive response, and improved sensitivity and reliability

Active Publication Date: 2017-05-31
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The main purpose of the embodiments of the present invention is to provide a pressure sensor and its manufacturing method, aiming to solve the technical problem of the small pressure detection range of the resistive pressure sensor in the prior art

Method used

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  • Pressure sensor and production method thereof
  • Pressure sensor and production method thereof

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Experimental program
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Embodiment 1

[0038] see figure 1 , the pressure sensor according to the first embodiment of the present invention is proposed, the pressure sensor includes two external electrodes 30 and two oppositely disposed substrates 10, the substrates 10 are elastic and conductive. like figure 1 As shown, there are micro-protrusion structures 11 (or micro-protrusion structures) on the contact surfaces (the opposite sides of the two substrates) of the two substrates 10, and the protrusion structures 11 of the two substrates 10 are preferably the same structure, the protruding structure 11 leads to a convex portion and a concave portion on the contact surface, and the convex portion and the convex portion on the contact surface of the two substrates 10 can be directly contacted, or the convex portion can be directly contacted with the concave portion. The surface of the protruding structure 11 is covered with a conductive layer 20, and each substrate 10 is connected with an external electrode 30 for c...

Embodiment 2

[0053] refer to Figure 4 , propose the preparation method of the pressure sensor of the second embodiment of the present invention, described method comprises the following steps:

[0054] S11. Prepare two elastic and conductive substrates, and at least one of the substrates has a protruding structure on the contact surface.

[0055] In this step S11, two elastic conductive substrates are prepared, and at least one of the substrates has a raised structure on the contact surface, which is the opposite surface when the last two substrates are folded together.

[0056] In the embodiment of the present invention, two substrates with the same raised structure are preferably prepared. In other embodiments, the raised structures on the two substrates may be different, or only one substrate has the raised structure. The raised structure on the contact surface of the substrate can be one or a combination of at least two regular three-dimensional structures such as prisms, pyramids, c...

example 1

[0076] (1) Using the silicon wafer as the substrate, a hemispherical hole array (depression structure array) is processed on the surface of the silicon wafer by MEMS technology, with a diameter of 20 μm, and the processed silicon wafer is used as a micro template.

[0077] (2) Use silver flakes with a particle size of 1-10 μm as the conductive filler, use polydimethylsiloxane (PDMS) as the matrix, and mix the PDMS prepolymer and its curing agent with the silver flakes by mechanical stirring to obtain a flexible Conductive paste (mixture in fluid form). The mass ratio of the PDMS prepolymer to its curing agent is 12:1-5:1, and the mass ratio of the PDMS and its curing agent (total mass of the two) to the silver sheet is 1:1-1:4.

[0078] (3) Deposit the flexible conductive paste made in the above step (2) on the silicon micro-template made in the above step (1) by scraping and printing with a mask plate, and cure the flexible conductive paste by heating at 80°C for 2 hours It ...

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Abstract

The invention discloses a pressure sensor and a production method thereof. The pressure sensor comprises two external electrodes, and two substrates which are oppositely arranged and are elastic, wherein a convex structure is arranged on the contact surface of at least one substrate; the contact surfaces are opposite surfaces of the two substrates; the substrates are conductors; each substrate is connected with one external electrode; the surface of the convex structure is covered by a conductive layer. According to the pressure sensor provided by the invention, a piezoresistive effect that under the action of a pressure, the elastic and conductive substrates deform to cause resistance change is utilized, an effect that under the action of a pressure, the contact surface area of the conductive layer on the surface of the convex structure of the substrate changes to cause contact resistance change is utilized, and through a synergistic effect of the two effects, the pressure detection range is greatly widened; compared with the conventional way that a circuit layer is arranged between the two substrates, the contact surface area of the conductive layer in the pressure sensor during deformation of the convex structure changes more, so that the sensitivity and the reliability of the pressure sensor are further improved.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to a pressure sensor and a preparation method thereof. Background technique [0002] A pressure sensor is an electronic device that converts stress into an electrical signal, and can be widely used in flexible touch screens, artificial intelligence, wearable electronics, mobile medicine and other fields. According to the signal conversion mechanism, pressure sensors are mainly divided into resistive sensors, capacitive sensors and piezoelectric sensors. Among them, the basic working principle of the resistive pressure sensor is to convert the change of the measured pressure into the change of the resistance value of the sensor. Resistive pressure sensors have attracted much attention due to their advantages such as simple device structure, stable and easy-to-measure resistance signal, and high sensitivity. [0003] Microstructuring the electrode array of a resistive pressure senso...

Claims

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Application Information

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IPC IPC(8): G01L1/22
CPCG01L1/22
Inventor 胡友根赵涛朱朋莉张愿朱玉梁先文孙蓉
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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