FPC board light source packaging structure and production method thereof

Abstract

The invention relates to a FPC board light source packaging structure and a production method thereof. The FPC board light source packaging structure comprises a FPC packaging board piece and is characterized in that the outer surface of the FPC packaging board piece is provided with a fluorescent powder adhesive layer, and a chip packaging layer is packaged in the fluorescent powder adhesive layer; the left side and the right side of the FPC packaging board piece are short edges which are identical in length and serve as arrangement edges, the upper side and the lower side of the FPC packaging board piece are long edges which are identical in length and serve as bending edges, the anode and the cathode of the chip packaging layer are respectively located in packaging areas close to the bending edges, and the FPC packaging board piece can be optionally bent leftwards and rightwards. The FPC board light source packaging structure has the advantages that the heat generation amount of a chip is lowered by using the large-power chip and lowering working currents, a radiator is not needed due to the fact that the heat generation amount of the whole FPC COB can be lowered, and production and mounting can be performed favorably according to different use requirements.

Description

technical field [0001] The invention relates to the technical field of LED lighting, in particular to an FPC board light source packaging structure and a production method thereof. Background technique [0002] Flexible printed circuit board (FPC) is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film, with high wiring density, light weight and thin thickness. , good bending characteristics. In the production process, in order to prevent the low yield rate caused by too many open and short circuits or reduce the scrapping and replenishment of FPC boards caused by rough process problems such as drilling, calendering, and cutting, and evaluate how to select materials to achieve customer use The best effect of the flexible circuit board, pre-production pretreatment is particularly important. [0003] The advantages of multilayer circuit boards are generally high assembly density, small size, and light weight. Because of high-dens...

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Problems solved by technology

[0005] Based on the actual situation, this case points out that there are many problems in the existing packaging structure of the same kind among many unsolved problems and expandable technical links. Small, the general FPC board is a soft board, which can be bent in one direction arbitrarily, but the FPC board itself cannot conduct heat, and the power cannot be increased. If the heat is dissipated with the help of heat-conducting double-sided adhesive, the effect will be limited; Most of the methods adopt formal installation, and a few adopt upside-down installation

[0006] At the same time, many of the current improvements are generally focused on organic light-emitting diodes, some of which are similar to traditional packaging methods of aluminum substrates or ceramic substrate COB LEDs, resulting in low light efficiency of OLEDs, expensive OLEDs, high heat generation, and sometimes even need to dissipate heat. or use a radiator

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