FPC board light source packaging structure and production method thereof

A packaging structure and light source technology, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of inflexibility or small bending range, high calorific value, and inability to increase power, and achieve high price and low calorific value. Effect

Pending Publication Date: 2017-05-31
中山市雅能照明科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Based on the actual situation, this case points out that there are many problems in the existing packaging structure of the same kind among many unsolved problems and expandable technical links. Small, the general FPC board is a soft board, which can be bent in one direction arbitrarily, but the FPC board itself cannot conduct heat, and the power cannot be increased. If the heat is dissipated with the help of heat-conducting double-sided adhesive, the effect wil

Method used

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  • FPC board light source packaging structure and production method thereof

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Comparison scheme
Effect test

Embodiment 1

[0033] Such as figure 1 As shown, the FPC board light source packaging structure described in the embodiment of the present invention is composed of an FPC packaging board 1, the outer surface of the FPC packaging board 1 has a fluorescent powder adhesive layer 2, and the inside of the fluorescent powder adhesive layer 2 is flip-chip. A chip encapsulation layer 5 is encapsulated by means of a method, and the two ends of the chip encapsulation layer 5 are provided with positive and negative electrode areas of the chip;

[0034] Further, the left and right sides of the FPC packaging plate 1 are all short sides of the same length and serve as the arrangement side 4, and at the same time, the upper and lower sides of the FPC package plate 1 are all long sides of the same length and are used as the bending side 3. The positive and negative poles of the chip packaging layer 5 are respectively located in the packaging area close to the bending edge 3, and since the positive and negat...

Embodiment 2

[0036] Such as figure 1 As shown, the FPC board light source packaging structure described in the embodiment of the present invention is composed of an FPC packaging board 1, the outer surface of the FPC packaging board 1 has a fluorescent powder adhesive layer 2, and the inside of the fluorescent powder adhesive layer 2 is flip-chip. A chip encapsulation layer 5 is encapsulated by means of a method, and the two ends of the chip encapsulation layer 5 are provided with positive and negative electrode areas of the chip;

[0037] Further, the left and right sides of the FPC packaging plate 1 are short sides of the same length and used as bending edges, and at the same time, the upper and lower sides of the FPC packaging plate 1 are long sides of the same length and used as the arrangement side, The positive and negative poles of the chip packaging layer 5 are respectively located in the packaging area close to the bending, and since the positive and negative poles of the chip are...

Embodiment 3

[0039] Such as figure 1 As shown, a production method of an FPC board light source packaging structure consists of the following steps,

[0040] ⑴First carry out the crystal-bonding operation, put the FPC board into the fixture, adjust the program of the crystal-bonding machine, and start the crystal-bonding;

[0041] ⑵ Reflow soldering operation, adjust the temperature of each temperature zone of the reflow soldering, put the solid crystal product together with the fixture into the reflow soldering for reflow soldering;

[0042] (3) Test the reflowed products;

[0043] ⑷The dam is required according to the size of the light-emitting surface;

[0044] ⑸ Prepare phosphor glue according to the requirements of each optical parameter, stir and defoam, and perform glue filling operation;

[0045] ⑹ Put the glued product into the oven for baking;

[0046] ⑺ After cooling at room temperature, remove the fixture cover, and pack the product into storage after optical and electrical...

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Abstract

The invention relates to a FPC board light source packaging structure and a production method thereof. The FPC board light source packaging structure comprises a FPC packaging board piece and is characterized in that the outer surface of the FPC packaging board piece is provided with a fluorescent powder adhesive layer, and a chip packaging layer is packaged in the fluorescent powder adhesive layer; the left side and the right side of the FPC packaging board piece are short edges which are identical in length and serve as arrangement edges, the upper side and the lower side of the FPC packaging board piece are long edges which are identical in length and serve as bending edges, the anode and the cathode of the chip packaging layer are respectively located in packaging areas close to the bending edges, and the FPC packaging board piece can be optionally bent leftwards and rightwards. The FPC board light source packaging structure has the advantages that the heat generation amount of a chip is lowered by using the large-power chip and lowering working currents, a radiator is not needed due to the fact that the heat generation amount of the whole FPC COB can be lowered, and production and mounting can be performed favorably according to different use requirements.

Description

technical field [0001] The invention relates to the technical field of LED lighting, in particular to an FPC board light source packaging structure and a production method thereof. Background technique [0002] Flexible printed circuit board (FPC) is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film, with high wiring density, light weight and thin thickness. , good bending characteristics. In the production process, in order to prevent the low yield rate caused by too many open and short circuits or reduce the scrapping and replenishment of FPC boards caused by rough process problems such as drilling, calendering, and cutting, and evaluate how to select materials to achieve customer use The best effect of the flexible circuit board, pre-production pretreatment is particularly important. [0003] The advantages of multilayer circuit boards are generally high assembly density, small size, and light weight. Because of high-dens...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L33/48H01L33/64H01L21/56
CPCH01L25/0753H01L33/486H01L33/642H01L21/563H01L2933/005
Inventor 何坚鹏
Owner 中山市雅能照明科技有限公司
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