Heat uniform distribution and dissipation structure and heat uniform distribution and dissipation process for portable electronic equipment

Abstract

The invention provides a heat uniform distribution and dissipation structure and a heat uniform distribution and dissipation process for portable electronic equipment. The heat uniform distribution and dissipation structure comprises a front shell and a rear shell. The rear shell is fastened at the rear of the front shell, a display screen and a touch screen are arranged at the front of the front shell, and electronic components are arranged inside a shell comprising the front shell and the rear shell. The heat uniform distribution and dissipation structure is characterized by further comprising heat uniform distribution layers and heat dissipation layers, the heat uniform distribution layers are arranged at the front of the portable electronic equipment, the heat dissipation layers are arranged at the rear of the portable electronic equipment, and a composite membrane is arranged on each electronic component. The heat uniform distribution and dissipation structure and the heat uniform distribution and dissipation process have the advantages that heat diffused by heat sources of the handheld equipment can be uniformly dispersed in integral cavities (by the heat uniform distribution layers), heat exchange can be carried out on the external (and the heat dissipation layers), accordingly, core temperatures can be definitely reduced, the problem of heating of machine bodies or breakdown can be solved, the performance of the electronic equipment can be relatively sufficiently played, and consumers can have excellent man-machine experience.

Description

technical field [0001] The invention relates to the field of heat dissipation structure technology, in particular to a heat dissipation structure and technology for portable electronic equipment. Background technique [0002] At present, the handheld devices on the market will experience partial overheating after long-term use. This phenomenon not only brings consumers a bad experience of excessively high tactile temperature, but also is caused by the core components of the mobile phone such as the high-performance CPU running. The heat cannot be transferred out in an effective way, so that the command cycle of the mobile phone is limited, and even the phenomenon of too slow crash occurs from time to time. Since the appearance of the current handheld device requires too thin thickness, there is no space reserved for the traditional heat transfer method. heat convection (using fans to obtain convection), so only heat conduction and heat radiation can be applied. At present, m...

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Problems solved by technology

[0002] At present, the handheld devices on the market will experience partial overheating after long-term use. This phenomenon not only brings consumers a bad experience of excessively high tactile temperature, but also is caused by the core components of the mobile phone such as the high-performance CPU running. The heat cannot be transferred out in an effective way, so that the command cycle of the mobile phone is limited, and even the phenomenon of too slow crash occurs from time to time. Since the appearance of the current handheld device requires too thin thickness, there is no space reserved for the traditional heat transfer method. heat convection (using fans to obtain convection), so only heat conduction and heat radiation can be applied. At present, most handheld devices on the market use high thermal conductivity materials such as graphite sheets and copper foils attached near the heat source. It achieves the purpose of heat dissipation, but the industry often confuses the concept of uniform heat dissipation. It is not clear what it means, and it is used casually. Judging from the large-screen mobile phones of Meizu, Xiaomi, Huawei and other brands on the market, there is no significant heat dissipation effect, and the local temperature is still high. , consumers often complain

[0003] In addition, the concept of uniform heat dissipation in the prior art is confused, and the heat dissipation effect is not obvious. The heat emitted by the heat source of the handheld device cannot be evenly distributed in the entire cavity, and the temperature of the core and the body continues to rise, causing the body to become hot or crash. Can only passively use software to reduce core efficiency, causing bad user experience to consumers

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