Damp-proof graphene composite heat dissipation film

Abstract

The invention discloses a moisture-proof graphene composite heat dissipation film, which comprises, from top to bottom, a PET release film layer, a first thermally conductive adhesive layer, a graphite paper layer, a second thermally conductive adhesive layer, a graphene layer, and a PET substrate layer , Water-absorbing resin layer. The thickness of the first thermally conductive adhesive layer and the second thermally conductive adhesive layer is 2 μm to 30 μm, the thickness of the graphite paper layer is 20 μm to 100 μm, the thickness of the graphene layer is 0.1 μm to 1 μm, and the thickness of the PET substrate layer The thickness is 25 μm-100 μm, and the thickness of the water-absorbing resin layer is 5 μm-12 μm. The moisture-proof graphene composite heat-dissipating film of the invention can improve the heat conduction effect and at the same time have the function of moisture-proofing, is easy to install and use, has low manufacturing cost, and is suitable for industrial production.

Description

technical field [0001] The invention relates to the field of heat dissipation materials, in particular to a moisture-proof graphene composite heat dissipation film. Background technique [0002] With the development of semiconductor technology, the feature size of VLSI has been continuously reduced. At present, integrated circuits have entered the nanometer era. At the nanometer level, the thermal stability of metals decreases and the resistivity increases, which will affect the heat dissipation performance of integrated circuits. Among traditional metal materials, copper has a thermal conductivity of 400 W / mk and is currently the main material for interconnection lines of integrated circuits. Metal materials can only dissipate heat, but cannot completely eliminate heat and increase the weight of electronic products. In contrast, carbon materials have high thermal conductivity, and the use of carbon materials to prepare heat dissipation films can improve the heat dissipatio...

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Problems solved by technology

[0003] Patent document CN 104057653 A discloses a graphite film / metal composite heat sink and its preparation method. The heat sink is composed of a high thermal conductivity graphite film, a heat conductive adhesive layer and a metal layer through a rewinding machine, which improves the heat conduction and heat dissipation. Ability, but this tape, like many other tapes, only provides a heat dissipation effect, poor weather resistance, and affects the use of heat dissipation film in a humid environment

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