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MEMS (Micro-Electro-Mechanical Systems) chip with back surface arc edge and manufacturing method thereof

A manufacturing method and technology of MEMS structure layer, which are used in the manufacture of microstructure devices, processes for producing decorative surface effects, decorative arts, etc., to achieve the effect of preventing damage

Active Publication Date: 2017-06-13
ANHUI BEIFANG XINDONG LIANKE MICROSYST TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to overcome the deficiencies in the prior art and provide a MEMS chip with a back rounded edge, the MEMS chip is rounded on the back to avoid the problem of poor reliability caused by cracks in the chip

Method used

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  • MEMS (Micro-Electro-Mechanical Systems) chip with back surface arc edge and manufacturing method thereof
  • MEMS (Micro-Electro-Mechanical Systems) chip with back surface arc edge and manufacturing method thereof
  • MEMS (Micro-Electro-Mechanical Systems) chip with back surface arc edge and manufacturing method thereof

Examples

Experimental program
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Embodiment 1

[0039] A method for manufacturing a MEMS chip with an arc-shaped edge on the back, comprising the following steps:

[0040] (1) Fabrication of base plate wafer 230: Coating photoresist on the back 231 of the monocrystalline silicon wafer, aligning with a photolithography plate for exposure, development, and forming a photoresist pattern as an etching mask, according to the etching depth of the groove 233 The different selection photoresist thickness of H, even selects the dry photonity polyimide of relative etch resistance as etching mask; Then carry out deep Si etching to single crystal silicon wafer back side 231 with reactive ion equipment, if single crystal silicon wafer There are other films on the back 231 of the sheet, such as SiO 2 、Si 3 N 4 , Al, Au, Ti, Ni, W, Pt or their composite layers, all films need to be removed by dry or wet process before deep Si etching, and there must be a large amount of lateral etching to ensure that the film It will not affect the for...

Embodiment 2

[0049] The back side of the MEMS disc 700 with the back side arc-shaped edge is made with the same groove 233 as the first embodiment for cutting the wafer, and two grooves 237 are also made, and the MEMS with the back side arc-shaped edge The back side 702 of the wafer 700 is divided into three loading columns 238, such as Figure 15 shown. The groove 233 and the groove 237 are formed at the same time, without adding any wafer processing steps, and only need to change the pattern of the photolithographic plate during the operation of step (1) of the first embodiment. Cutting the MEMS wafer 700 with arc-shaped edges on the back to obtain a MEMS chip 800 with arc-shaped edges on the back.

[0050] The MEMS chip 800 with the arc-shaped edge on the back made in this embodiment, such as Figure 16 As shown, the cover plate 810, the MEMS structure layer 820 and the bottom plate 830 are stacked together by wafer bonding technology. The lower surface of the cover plate 810 has an u...

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Abstract

The invention discloses an MEMS (Micro-Electro-Mechanical Systems) chip with a back surface arc edge, and a manufacturing method thereof. The side surface of the MEMS chip consists of a vertical part vertical to the lower surface of a bottom plate and the arc edge, wherein the arc edge consists of a lower rounded corner, a side wall, an upper rounded corner and a top part; the surface of the arc edge is wavy; and pits are fully distributed in the surface of the arc edge. According to the manufacturing method, on the premise that an additional process flow is not added, grooves are formed in the back surface while a bottom plate wafer is manufactured, the arc edge and a rough edge surface can be formed by cutting a wafer along the grooves when the wafer is subsequently cut, so that the problem of low reliability of the MEMS chip caused by damage to the wafer during wafer cutting or a subsequent packaging process is prevented.

Description

technical field [0001] The invention belongs to the field of MEMS chip manufacturing, and in particular relates to a MEMS chip with a backside arc-shaped edge, and the invention also relates to a method for manufacturing the MEMS chip with a backside arc-shaped edge. Background technique [0002] MEMS (Micro-Electro-Mechanical Systems) is the abbreviation of micro-electro-mechanical systems. MEMS chip manufacturing technology uses micro-fabrication technology, especially semiconductor wafer manufacturing technology, to manufacture various micro-mechanical structures, combined with application-specific control integrated circuits (ASICs), Composition of intelligent micro-sensors, micro-actuators, micro-optical devices and other MEMS components. There are quite a few types of MEMS devices that have completed wafer-level packaging during wafer processing, that is, during the MEMS wafer manufacturing process, the MEMS structure 121 is sealed in a cover plate 110 with an upper ca...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/00B81C1/00
CPCB81B7/0051B81C1/00666
Inventor 华亚平
Owner ANHUI BEIFANG XINDONG LIANKE MICROSYST TECH