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Preparation of low-viscosity organosilicon material

A silicone and low-viscosity technology, applied in the field of synthetic chemistry, can solve the problems of high and low temperature impact resistance and other problems, and achieve the effects of low production cost, no solvent, and simple synthesis reaction process

Inactive Publication Date: 2017-06-13
烟台鑫海耐磨胶业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, compared with international epoxy potting materials, there are still some gaps in elasticity, elimination of internal stress, resistance to cracking, high and low temperature impact resistance, etc.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0007] Accurately weigh 350g of vinyl silicone oil, 4g of low-hydrogen-containing silicone oil cross-linking agent, 20g of microcapsule-type platinum catalyst, 20g of carbon black, 800g of modified silicon oxide powder with an average particle size of 5μm, and a spherical hydrogen Add 600g of alumina powder and 200g of aluminum hydroxide powder with an average particle size of 10μm into a 2L double planetary power mixer in turn, and stir for 3 hours under the conditions of rotation speed of 100 rpm and revolution speed of 8 rpm After that, you get it.

Embodiment 2

[0009] Accurately weigh 380g of vinyl silicone oil, 4g of low-hydrogen silicone oil cross-linking agent, 20g of microcapsule-type platinum catalyst, 20g of carbon black, 800g of modified silica powder with an average particle size of 5μm, and a spherical hydrogen Add 600g of alumina powder and 200g of aluminum hydroxide powder with an average particle size of 10μm into a 2L double planetary power mixer in turn, and stir for 5 hours under the conditions of rotation speed of 100 rpm and revolution speed of 8 rpm After that, you get it.

Embodiment 3

[0011] Accurately weigh 260g of vinyl silicone oil, 4g of low-hydrogen-containing silicone oil cross-linking agent, 20g of microcapsule-type platinum catalyst, 20g of carbon black, 800g of modified silica powder with an average particle size of 5 μm, and a spherical hydrogen Add 600g of alumina powder and 200g of aluminum hydroxide powder with an average particle size of 10μm into a 2L double planetary power mixer in turn, and stir for 4 hours under the conditions of rotation speed of 100 rpm and revolution speed of 8 rpm After that, you get it.

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PUM

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Abstract

The invention relates to the preparation of a low-viscosity organosilicon material. The preparation comprises the following steps: accurately weighing 350-380 g of polyvinyl silicone oil, 4 g of a low hydrogen-containing silicone oil crosslinking agent, 20 g of a microcapsule platinum catalyst, 20 g of carbon black, 800 g of a modified silicon oxide powder with the average grain diameter of 5 mum, 600 g of a spheroid aluminum hydroxide powder with the average grain diameter of 40 mum, and 200 g of an aluminum hydroxide powder with the average grain diameter of 10 mum, sequentially adding the materials into a 2L double-planet power mixer, and stirring for 3-5 hours at the autorotation speed of 100 revolutions per minute and at the revolution speed of 8 revolutions per minute.

Description

technical field [0001] The invention relates to the preparation of a low-viscosity organosilicon material, which belongs to the field of synthetic chemistry. Background technique [0002] Epoxy resin and silicone potting materials are widely used in the potting of electronic components and their components due to their excellent performance. At present, compared with international epoxy potting materials, there are still some gaps in terms of elasticity, elimination of internal stress, resistance to cracking, and high and low temperature impact resistance. Silicone potting materials have a wide working temperature range, excellent high and low temperature impact resistance, no heat absorption or heat release during curing, and no shrinkage after curing; excellent electrical properties and chemical stability, good corrosion resistance, weather resistance, and excellent thermal conductivity . Used as electronic potting material, it can play the role of dust-proof, moisture-p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08K13/06C08K3/36C08K3/04C08K3/22
Inventor 阎珊珊
Owner 烟台鑫海耐磨胶业有限公司
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