Adhesive film for bonding composite boards and its preparation method and application

A technology for composite boards and boards, applied in chemical instruments and methods, film/sheet adhesives, adhesives, etc., can solve the problems of low moisture content, increase energy consumption, energy waste, etc., and achieve boiling-resistant bonding strength performance , High bonding strength performance, the effect of shortening the drying time

Active Publication Date: 2020-02-18
福建和其昌树脂科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Whether it is bamboo, wood or bamboo-wood mixed boards, the bamboo veneer and wood veneer must be dried, and the moisture content of the board after drying and before dipping is clearly limited, and the moisture content of the dried veneer is required. The moisture content of bamboo curtains and bamboo mats is lower than 6%. If the boards with moisture content that do not meet the requirements are directly used for dipping, it will affect the smooth progress of dipping, resulting in Not enough glue
In order to increase the amount of glue absorbed, the dipping time will be extended, which will lead to the absorption of more water during the dipping process, and the drying time after dipping will also be extended accordingly. The requirement of lower moisture content after drying and the extension of the drying time are even increase energy consumption
[0004] Moreover, the single-layer sheet after dipping must be dried until the moisture content is 10-15% before it can be used and assembled, resulting in energy waste and repeated operations; after the assembly, a press is used for hot pressing, and the hot pressing process requires The "cold in and cold out" production process is adopted, that is, during the hot pressing process, the assembled slabs must be heated and pressurized. After a certain hot pressing time, they must be cooled to 45°C or lower before the pressure is released and the slabs will be released. cause energy waste

Method used

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  • Adhesive film for bonding composite boards and its preparation method and application
  • Adhesive film for bonding composite boards and its preparation method and application
  • Adhesive film for bonding composite boards and its preparation method and application

Examples

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preparation example Construction

[0034] The present invention also provides a method for preparing the adhesive film described in the above technical solution, comprising: coating the thermosetting resin on both sides of the polyolefin surface and then baking to obtain the adhesive film.

[0035] In the present invention, the coating process preferably adjusts the pH of the thermosetting resin to 10-13, more preferably 11-12.5, more preferably 12. In the present invention, the limitation of the pH value is to effectively improve the activity of the glue, reduce the volatile content of the resin glue, and then improve the stability of the resin glue, increase the storage time, and ensure that the resin glue is coated on both sides of the polyolefin surface. maintain a certain degree of pre-curing. In the present invention, the adjustment of the pH value is preferably by mixing the thermosetting resin with an alkaline substance; in the present invention, the alkaline substance is preferably potassium hydroxide,...

Embodiment 1

[0064] Preparation of all-bamboo container floor:

[0065] Preparation of adhesive film for composite board: adjust the pH value of phenolic resin with a solid content of 45wt% and a viscosity of 30s at 25°C to 13, and then spray it on both surfaces of polyethylene plastic, wherein the quality of the phenolic resin is poly 35% of the mass of vinyl plastic; then dry at 50°C for 3 minutes to obtain a film.

[0066] The moisture of the whole bamboo board is dried to a moisture content of 19wt%, and the surface of the board is 83.8g / m 2 After coating the prepared adhesive film according to the standard, it is bonded to another board; then the adhesive film is coated on the unbonded surface of the other board, and so on. body.

[0067] According to 26kgf / cm 2 The standard defines the pressure value of hot pressing. Under the condition of 5.0MPa, the temperature is raised to 140°C in the core layer, and the heating time is determined according to the heating time standard of 1min...

Embodiment 2

[0073] Preparation of all-wood Class I weather-resistant plywood:

[0074] Preparation of adhesive film for composite board: adjust the pH value of phenolic resin with a solid content of 45wt% and a viscosity of 150s at 25°C to 13, and then spray it on both surfaces of polypropylene plastic, wherein the quality of the phenolic resin is polyethylene 5% of the plastic mass; then dry at 50°C for 3 minutes to obtain a film.

[0075] Dry the moisture of the whole wood board until the water content is 7.5-8.8wt%, and the surface of the board shall be 25.5g / m 2After coating the prepared adhesive film according to the standard, it is bonded to another board; then the adhesive film is coated on the unbonded surface of the other board, and so on. body.

[0076] According to 10~12kgf / cm 2 The standard defines the pressure value of hot pressing. Under the condition of 2.0MPa, the heating time is determined according to the heating time standard of 0.7min per unit millimeter thickness o...

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Abstract

The invention provides an adhesive film for bonding a composite board. The adhesive film comprises a polyolefin layer and a thermosetting resin layer arranged on the polyolefin layer surface, wherein the thermosetting resin layer is obtained by coating and curing the thermosetting resin on double-side of the polyolefin surface; the mass of the thermosetting resin is 0.5-35% of the polyolefin mass; the thermosetting resin structure contains phenolic hydroxyl and formyl group. The adhesive film provided by the invention is used for the bonding in the preparation process of the composite board, the water content requirement on the composite board before adhesion is low, and the operation of controlling the water content to be less than 12% is unnecessary, even less than 6%, the board veneer surface bonding process can be accomplished, and the veneer gumming is unnecessary to prevent more moisture from being absorbed, and then the glue-drying time in the composite board preparation process can be shortened.

Description

technical field [0001] The invention belongs to the technical field of composite board preparation, and in particular relates to an adhesive film for bonding composite boards, a preparation method and application thereof. Background technique [0002] The boards include all-bamboo composite boards, wood composite boards and bamboo-wood composite boards, which are obtained by drying the raw boards, bonding them with an adhesive, and then drying the rubber to form a blank. [0003] Whether it is bamboo, wood or bamboo-wood mixed boards, the bamboo veneer and wood veneer must be dried, and the moisture content of the board after drying and before dipping is clearly limited, and the moisture content of the dried veneer is required. The moisture content of bamboo curtains and bamboo mats is lower than 6%. If the boards with moisture content that do not meet the requirements are directly used for dipping, it will affect the smooth progress of dipping, resulting in Adhesive is not...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/24B32B7/12B32B37/06B32B37/12
CPCB32B7/12B32B37/06B32B37/1207C09J7/22C09J7/30C09J2301/124C09J2423/046C09J2423/106C09J2425/006C09J2427/006C09J2461/00
Inventor 郑忠福俞艳肖卫红林上禄陈长德
Owner 福建和其昌树脂科技有限公司
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