Substrate cleaning apparatus and substrate cleaning method

A technology for cleaning devices and substrates, applied in cleaning methods and appliances, cleaning methods using liquids, chemical instruments and methods, etc., can solve the problems of basement membrane erosion and collapse of substrates, and achieve the effect of suppressing pattern collapse

Active Publication Date: 2017-06-13
TOKYO ELECTRON LTD
View PDF5 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, if a method of removing particles using physical force is used as in the technology described in Patent Document 1, the pattern formed on the surface of the substrate may be collapsed by the physical force.
[0008] In addition, if a method of removing particles by chemical action of a chemical solution is used as in the technique described in Patent Document 2, for example, the base film of the substrate may be corroded by an etching action or the like.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate cleaning apparatus and substrate cleaning method
  • Substrate cleaning apparatus and substrate cleaning method
  • Substrate cleaning apparatus and substrate cleaning method

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0039] Outline structure of substrate cleaning system

[0040] First, use figure 1 A schematic configuration of the substrate cleaning system according to the first embodiment will be described. figure 1 It is a figure which shows the schematic structure of the board|substrate cleaning system of 1st Embodiment.

[0041] In addition, hereinafter, in order to clarify the positional relationship, the mutually orthogonal X-axis, Y-axis, and Z-axis are defined, and the positive direction of the Z-axis is defined as a vertically upward direction. In addition, hereinafter, the side in the negative direction of the X-axis is defined as the front of the substrate cleaning system, and the side in the positive direction of the X-axis is defined as the rear of the substrate cleaning system.

[0042] Such as figure 1 As shown, the substrate cleaning system 100 includes an input and output station 1 , a delivery station 2 and a processing station 3 . The input / output station 1 , trans...

no. 2 Embodiment approach

[0130] In addition, in the above-mentioned first embodiment, volatilization of volatile components contained in the overcoat liquid is accelerated by heating the overcoat liquid or reducing the humidity in the chamber 10 or making the chamber 10 in a decompressed state. However, the volatilization acceleration treatment is not limited to the treatment described in the first embodiment. Below, use Figure 6 Another example of volatilization promotion treatment will be described. Figure 6 It is a schematic diagram showing the structure of the substrate cleaning apparatus of the second embodiment. In addition, in the following description, the same code|symbol as the part which was already demonstrated is attached|subjected to the part which was already demonstrated, and redundant description is abbreviate|omitted.

[0131] A substrate cleaning apparatus 5A of the second embodiment includes an ultraviolet irradiation unit 60 in addition to each component included in the substr...

no. 3 Embodiment approach

[0135] The structure of the substrate cleaning apparatus is not limited to the structures shown in the above-mentioned embodiments. Therefore, the following, using Figure 7 Another configuration of the substrate cleaning apparatus will be described. Figure 7 It is a schematic diagram showing the structure of the substrate cleaning apparatus of the third embodiment. In addition, in the following description, the same code|symbol as the part which was already demonstrated is attached|subjected to the part which was already demonstrated, and redundant description is abbreviate|omitted.

[0136] Such as Figure 7 As shown, the substrate cleaning apparatus 5B of the third embodiment includes a chamber 10 ′, a substrate holding unit 20 ′, and a recovery cup 40 ′ instead of the chamber 10 and the substrate holding unit 20 of the substrate cleaning apparatus 5 of the first embodiment. And recovery cup 40. Furthermore, the substrate cleaning apparatus 5B includes a top plate 213 ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a substrate cleaning apparatus and a substrate cleaning method. Particles attached on a substrate are removed while restraining pattern collapse and basilar membrane erosion. The substrate cleaning apparatus comprises a first liquid supply part and a second liquid supply part. The first liquid sypply part is used for supplying a treating fluid to the substrate, and the treating fluid contains volatile ingredients and is used for forming membranes on the substrate. The second liquid supply part is used for supplying the treating fluid with a removing fluid used for completely removing the treating fluid which is supplied to the substrate by the first liquid supply part and solidified and hardened on the substrate because of volatilization of the volatile ingredients.

Description

[0001] This application is a divisional application of the application number 201310334657.7, the application date is August 2, 2013, and the invention name is "substrate cleaning device, substrate cleaning system and substrate cleaning method". technical field [0002] The invention relates to a substrate cleaning device and a substrate cleaning method. Background technique [0003] Conventionally, a substrate cleaning device for removing particles adhering to substrates such as silicon wafers and compound semiconductor wafers is known. [0004] As such a substrate cleaning device, there is a substrate cleaning device that removes particles by utilizing physical force generated by supplying a fluid such as liquid or gas to the surface of the substrate (see Patent Document 1). Also known is a substrate cleaning device that supplies a chemical solution such as SC1 to the surface of a substrate and removes particles by utilizing the chemical action (eg, etching action) of the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/687H01L21/02
CPCH01L21/02057H01L21/67051H01L21/6708H01L21/6715H01L21/68728H01L21/02052H01L21/6704H01L21/67103H01L21/6838H01L21/02041B08B3/08H01L21/0206
Inventor 金子都折居武彦志村悟山下刚秀菅野至
Owner TOKYO ELECTRON LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap