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Nozzle for heating device, heating device, and nozzle for cooling device

A nozzle and heater technology, which is applied in the fields of nozzles of heating devices, nozzles of heating devices and cooling devices, can solve the problems of increased power consumption, increased fan motor output, short motor life, etc., and achieves cooling capacity improvement and reduction. The effect of reducing power consumption and preventing reduction

Active Publication Date: 2017-06-20
SENJU METAL IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] In addition, although Citation 1 can uniformly heat the object to be heated because it includes a plurality of ejection ports and a plurality of recovery ports, in order to improve the efficiency of heating objects such as printed circuit boards, it is necessary to increase the output of the fan motor.
However, when the output of the fan motor is increased, there is a problem that power consumption increases
In addition, when the output of the fan motor increases, the rotation speed of the motor will increase, which will shorten the life of the motor, so it is not ideal.

Method used

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  • Nozzle for heating device, heating device, and nozzle for cooling device
  • Nozzle for heating device, heating device, and nozzle for cooling device
  • Nozzle for heating device, heating device, and nozzle for cooling device

Examples

Experimental program
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Effect test

no. 1 Embodiment approach

[0050] Configuration Example of Reflow Soldering Apparatus 100

[0051] figure 1 It is a front sectional view showing a configuration example of the reflow soldering apparatus 100 according to the first embodiment. Such as figure 1 As shown, the reflow soldering apparatus 100 is composed of a main body 101 and a conveyor belt 102 for transporting a heating object such as a printed circuit board.

[0052] There are three zones of a preliminary heating zone A, a main heating zone B, and a cooling zone C in the main body portion 101 . The printed circuit boards to be soldered in the reflow soldering apparatus 100 are conveyed by the conveyor belt 102 in the order of the preliminary heating zone A, the main heating zone B and the cooling zone C.

[0053] The preliminary heating area A is an area for gradually heating the printed circuit board, electronic components mounted on the printed circuit board, etc. to adapt the printed circuit board, electronic components mounted on ...

no. 2 Embodiment approach

[0106] In this embodiment, 1 A of nozzle apparatuses which changed the shape of the suction port 3b of the nozzle apparatus 1 demonstrated in said 1st Embodiment are demonstrated. Since members having the same names and reference numerals as those in the first embodiment described above have the same functions, description thereof will be omitted.

[0107] Figure 14 It is a perspective view which shows the structural example of 1 A of nozzle apparatuses of 2nd Embodiment. Such as Figure 14 As shown, the nozzle device 1A is composed of a blowing nozzle 2 and a nozzle cover 3A. The blowing nozzle 2 is the same as the blowing nozzle described in the above-mentioned first embodiment.

[0108] The hole 3a for blowing nozzles and the suction port 3c are perforated in 3 A of nozzle covers. The suction port 3c has a circular shape, and it is pierced in the vicinity of the hole 3a for blowing nozzles so that it may be located in the vicinity of the blowing nozzle 2. Then, the su...

no. 3 Embodiment approach

[0114] In this embodiment, the blowing nozzle which changed the shape of the blowing nozzle 2 demonstrated in the said 1st Embodiment is demonstrated. Since members having the same names and reference numerals as those in the first embodiment described above have the same functions, description thereof will be omitted.

[0115] Figure 15 It is a sectional perspective view which shows the structural example of the blowing nozzle 2B of 3rd Embodiment. Such as Figure 15 As shown, the blowing nozzle 2B is composed of a nozzle main body 21B and a cross hole member 23B.

[0116] The nozzle main body 21B is different from the above-mentioned nozzle main body 21 in which the cross hole is integrally formed, and the nozzle main body 21B is formed by fitting the cross hole member 23B at the tip of the cylindrical gas flow path 24B. The nozzle main body 21B is formed of a metal material having good thermal conductivity such as aluminum or copper, and the gas flow path 24B may be for...

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Abstract

To achieve an improvement of heat exchanger effectiveness (heat transfer rate) without any increase of a fan motor output. The gas heated by the heating units or the gas cooled down by the cooling units is sent to the blowing nozzles 2 by a fan. Then, the blowing nozzles 2 blow the gas sent by the fan through their outlets. Each of the outlets has a non-circular planar shape with a projection portion thereof being projected inwardly. This allows a shape of the gas in cross section perpendicular to a direction where the gas is blown through the outlet of each of the blowing nozzles 2 to be changed by the projection portion with time (switching phenomenon) . Such a stitching phenomenon enables to be increased the heat exchanger effectiveness (heat transfer rate) on the printed board even if any output of the fan motor for rotating the fan does not increase.

Description

[0001] This application is a divisional application of an application with a filing date of August 3, 2010, an application number of 201080042596.1, and an invention title of "Nozzle for heating device, nozzle for heating device and cooling device". technical field [0002] The present invention relates to a nozzle of a heating device that blows hot air to heat an object to be heated, and a heating device, and a nozzle to a cooling device that blows cold air to cool an object to be cooled. Background technique [0003] When melting a solder material to solder an electronic component to a printed circuit board, a heating furnace such as a reflow apparatus is used. The reflow soldering device has a preliminary heating zone, a formal heating zone and a cooling zone in a channel-shaped muffle furnace, a heater for heating is provided in the preliminary heating zone and a formal heating zone, and a water-cooled tube is installed in the cooling zone. , cooling fan and other compon...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/00B23K1/008B23K3/08H05K3/34B23K101/42
CPCB23K1/008B23K3/04B23K31/02H05K3/34B23K1/0016B23K3/08H05K3/3494B23K2101/42
Inventor 加贺谷智丈
Owner SENJU METAL IND CO LTD
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