Flexible semiconductive shielding material and preparation method thereof
A semi-conductive, shielding material technology, applied in the fields of magnetic/electric field shielding, electrical components, etc., can solve the problems of hardening, embrittlement, processing performance and degradation of semi-conductive shielding materials
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Embodiment 1
[0014] Embodiment 1: Preparation of flexible semiconductive shielding material
[0015] (1) 70.0 grams of EVA particles were first added to the torque rheometer at 115 ° C, the rotating speed was 65 rpm, then 30.0 grams of high-conductivity carbon black and 0.5 grams of antioxidant 1010 were added, and melt blended for 6 minutes;
[0016] (2) 30.0 grams of SEBS were added to the mixture of (1), melt blended for 3 minutes;
[0017] (3) Add 1.0 gram of crosslinking agent DCP, 1.5 gram of crosslinking aid TAIC and 1.0 gram of solid paraffin into the mixture of (2), melt and blend for 3 minutes, quickly take out the material from the mixer and cool to room temperature;
[0018] (4) Put the sample into a stainless steel mold with a polytetrafluoroethylene isolation film, preheat it at 160°C for 1 minute with a flat vulcanizer, mold it under a pressure of 10 MPa for 8 minutes, and then cool it on a flat vulcanizer at room temperature Press and shape to obtain a sheet sample for tes...
Embodiment 2
[0022] Embodiment 2: Preparation of flexible semiconductive shielding material
[0023] 70.0 grams of EVA; 35.0 grams of highly conductive carbon black; 1.0 grams of antioxidant 1010; 20.0 grams of SBS thermoplastic elastomer; 1.5 grams of crosslinking agent DCP, 2.5 grams of crosslinking auxiliary agent TAIC and 1.5 grams of paraffin wax. The rest is the same as implementation 1.
Embodiment 3
[0024] Embodiment 3: Preparation of flexible semiconductive shielding material
[0025] 80.0 grams of EVA; 40.0 grams of highly conductive carbon black; 1.5 grams of antioxidant 1010; 25.0 grams of SEBS thermoplastic elastomer; 2.0 grams of crosslinking agent DCP, 3.0 grams of crosslinking auxiliary agent TAIC and 2.5 grams of solid paraffin. The rest is the same as implementation 1.
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Abstract
Description
Claims
Application Information
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