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Stacked Electronic Components

A technology of alternating lamination of electronic components, applied in the direction of fixed capacitance parts, laminated capacitors, fixed capacitor dielectrics, etc., can solve the problems of adhesive strength, poor adhesion, and structural defects of capacitors, etc., to achieve good adhesion strength, Good effect of thermal shock resistance

Active Publication Date: 2019-05-07
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in multilayer ceramic electronic components, if ceramics are baked on the side surface, the adhesion between the side surface and the ceramic (side gap) coated and formed on the side surface is poor, so structural defects of the capacitor are likely to occur due to electrostriction. In addition, It is difficult to relax external stress and there may be problems in adhesive strength

Method used

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  • Stacked Electronic Components
  • Stacked Electronic Components
  • Stacked Electronic Components

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0095] Overall Structure of Multilayer Ceramic Capacitors

[0096] As one embodiment of the multilayer electronic component according to this embodiment, the overall structure of a multilayer ceramic capacitor will be described.

[0097] Such as figure 1 As shown, the multilayer ceramic capacitor 2 according to the present embodiment has a ceramic sintered body 4 , a first external electrode 6 , and a second external electrode 8 . In addition, ceramic sintered body 4 has element main body 3 and insulating layer 16 .

[0098] The element body 3 has inner dielectric layers 10 and inner electrode layers 12 substantially parallel to a plane including the X-axis and the Y-axis, and the inner electrode layers 12 are alternately laminated between the inner dielectric layers 10 along the Z-axis direction. Here, "substantially parallel" means that most of them are parallel, but there may be some non-parallel parts, and the internal electrode layer 12 and the inner dielectric layer ...

no. 2 Embodiment approach

[0193] The multilayer ceramic capacitor according to this embodiment is the same as that of the first embodiment except that the outer electrodes 6 and 8 must cover the maximum width of the mountain portion 16 b in the X-axis direction at the end of the insulating layer 16 in the Y-axis direction. Same, repeated explanations are omitted.

[0194] In this embodiment, if Figure 2B , Figure 2C or Figure 3A As shown, both ends of the external electrodes 6 and 8 in the X-axis direction cover the maximum width (Mt) in the X-axis direction of the peaks at both ends of the insulating layer 16 in the Y-axis direction. Thereby, the adhesive strength of the laminated ceramic capacitor of this embodiment becomes favorable.

[0195] Additionally, if Figure 3A As shown in FIG. Let α be α, and let the covering length along the Y-axis direction of the external electrodes 6 and 8 covering the insulating layer 16 from the end of the element body 3 in the Y-axis direction be β.

[0196...

no. 3 Embodiment approach

[0201] In the multilayer ceramic capacitor according to this embodiment, other than Figure 2D , Figure 2E as well as Figure 3C As shown, the insulating layer 16' is composed of mountain-shaped parts 16b' and valley-shaped parts 16c' formed on the periphery of the end surface (side surface) in the X-axis direction, and the flat part 16c is not visible, and the rest is the same as that of the first embodiment. Same, repeated explanations are omitted.

[0202] In this embodiment, if Figure 3C As shown, the imaginary line drawn in the valley-shaped portion 16c' of the insulating layer 16' passing through the valley-shaped portion minimum point 16c1' and drawn in a direction perpendicular to the X-axis direction defines the second inner side of the mountain-shaped portion 16b'. When the angle formed by the tangent to the curved surface at the position 16b1' is θ1', θ1' is preferably 5° to 25°. Thereby, adhesive strength can be made favorable. In addition, the valley portio...

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Abstract

The invention relates to a laminated electronic part. The laminated electronic part is provided with an element main body, which comprises an internal electrode layer and a dielectric layer alternatively laminated along a third axis and parallel to a plane comprising a first axis and a second axis. Insulation layers are disposed on the pair of side surfaces of the element main body, which are opposite to each other along the direction of the first axis. The pair of the side surface of the element main body, which are opposite to each other along the second axis direction are provided with external electrodes electrically connected with the internal electrode layer. The insulation layers are provided with mountain-shaped parts formed on the peripheries of the side surfaces and the plane parts of the central parts of the side surfaces. The included angles between the surface phantom lines along the surfaces of the plane parts of the insulation layers and the tangent lines of the curved surfaces of the first inner side predetermined positions of the mountain-shaped parts are set to be theta one, and the included angles between the surface phantom lines along the surfaces of the plane parts of the insulation layers and the tangent lines of the curved surfaces of the first outer side predetermined positions of the mountain-shaped parts are set to be theta two, and theta one is in a range from 5degrees to 25degrees, and theta two is in a range from 5degrees to 25degrees.

Description

technical field [0001] The present invention relates to a laminated electronic component. Background technique [0002] In recent years, as the density of electronic circuits used in digital electronic devices such as mobile phones has increased, there has been an increasing demand for miniaturization of electronic components, and the miniaturization and increase in capacity of the laminated electronic components constituting the circuits have been rapidly progressing. [0003] In a multilayer electronic component such as a multilayer ceramic capacitor, a plurality of internal electrodes are arranged in the element body. In Patent Document 1, a conductive paste is printed so as to cover the full width of a rectangular ceramic green sheet, and a plurality of printed electrodes are laminated. A ceramic green sheet having the conductive paste was cut to obtain a laminate in which both side edges of the conductor layer were exposed. [0004] Furthermore, in Patent Document 1, b...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G4/12H01G4/30
CPCH01G4/12H01G4/30
Inventor 冈井圭祐远藤诚进藤宏史杉浦结郡司知训野田洋平田中博文
Owner TDK CORPARATION