Graphene photoluminescent substrate and preparation method and application thereof

Abstract

The invention provides a graphene photoluminescent substrate having a sandwich structure. The core layer of the sandwich structure is a photoluminescent material layer, and the surface layer of the sandwich structure is a graphene layer. At the same time, the invention provides a preparation method and application of the graphene photoluminescent substrate. Graphene is adopted as a protective layer of a photoluminescent substrate, so that a photoluminescent material sensitive to heat is effectively prevented from being affected by high temperature generated when an LED chip works, and erosion of the photoluminescent material by micromolecules such as oxygen and water can also be avoided, thereby maintaining relatively high luminescent performance; and graphene itself has a low absorptivity of light, and does not have obvious influence on luminescent performance of a solid luminescent device. Thus, by adoption of the graphene photoluminescent substrate provided by the invention, the application range of the photoluminescent material sensitive to heat can be greatly expanded without substantially transforming an existing solid luminescent device manufacturing technology on the basis of an LED chip.

Description

technical field [0001] The invention relates to the field of photoluminescence materials, in particular to a graphene photoluminescence substrate and a preparation method and application thereof. Background technique [0002] Solid luminescence refers to the phenomenon that electromagnetic waves, electrical energy, mechanical energy and chemical energy act on solids and are converted into light energy. Solid-state light-emitting technology is a field that has developed rapidly in recent years. Various light-emitting devices based on semiconductor light-emitting diodes (LEDs) and photoluminescent materials are widely used in lighting and display fields. [0003] In the prior art, the photoluminescent material is usually directly coated on the surface of the LED chip, but this technology is only suitable for photoluminescent materials that are not highly sensitive to temperature, because the surface temperature of the LED chip is relatively high when it is working. For photol...

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Problems solved by technology

[0003] In the prior art, the photoluminescent material is usually directly coated on the surface of the LED chip, but this technology is only suitable for photoluminescent materials that are not highly sensitive to temperature, because the surface temperature of the LED chip is relatively high when it is working. , for photoluminescent materials with high temperature sensitivity, such as inorganic semiconductor materials with high color purity, there will be a problem that the luminescence performance of photoluminescent materials will decrease due to high operating temperature

Although there is also a remote excitation technology that places the photoluminescent material at a certain distance from the LED chip to solve the problem of overheating of the photoluminescent material, this will also bring about a significant increase in cost and complex overall design of the light-emitting device. A series of problems, which are greatly limited in practical application

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