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High-lead semiconductor flux paste, preparation method and solder paste

A semiconductor and flux paste technology, used in welding equipment, manufacturing tools, welding media, etc., can solve the problems of low solder paste fluidity, poor alloy compatibility, and poor solder paste performance, and achieve good fluidity and compatibility. The effect of good performance and high welding strength

Active Publication Date: 2019-08-02
深圳市爱汶斯特科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Soldering paste is an important part of solder paste. The performance of soldering paste affects the use of soldering paste. Due to the existing soldering paste, its activity is low, its solubility is weak, and its compatibility with alloys is poor, resulting in tin The performance of the paste is poor. When the solder paste prepared by the existing solder paste is applied to the soldering of semiconductor devices, the soldering strength is small and the fluidity of the solder paste is small, which is easy to cause poor soldering and voids, especially for high-power semiconductor devices. In a high temperature environment, the strength after soldering is obviously insufficient, and the compatibility of existing solder pastes for gold-plated, copper-plated, silver-plated products is relatively poor, and the strength is also obviously insufficient when applied to these products

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] A kind of preparation method of high-lead semiconductor solder paste involved in the present embodiment, comprises the steps:

[0026] Step (1): Prepare mixture A, add the following components to a container in turn, heat to 100°C and keep stirring until completely dissolved to obtain mixture A. The weight percentages of each component in the solder paste are: rosin 30wt. %, resin 3wt.%, high boiling point solvent 30wt.%, thixotropic agent 3wt.%, organic active agent 7wt.%, high temperature active agent 2wt.%, antioxidant 2wt.%, monobasic acid 1.5wt.%.

[0027] Step (2): prepare activator B, add polybasic acid, dibasic acid, alcohol solvent into a beaker and heat and stir to dissolve, wherein polyacid, dibasic acid and alcohol solvent account for the weight percentage of activator B respectively: 10.8wt.%, 5.24wt.%, 74.68wt.%.

[0028] Step (3): Cool the mixture A in step (1) to 50-60°C.

[0029] Step (4): Add organic amine and activator B to the cooled mixture A, whe...

Embodiment 2

[0031] A kind of preparation method of high-lead semiconductor solder paste involved in the present embodiment, comprises the steps:

[0032] Step (1): To prepare mixture A, add the following components to a container in turn, heat to 120°C and keep stirring until completely dissolved to obtain mixture A. The weight percentages of each component in the solder paste are: rosin 25wt. %, resin 5wt.%, high boiling point solvent 25wt.%, thixotropic agent 4wt.%, organic active agent 8wt.%, high temperature active agent 3wt.%, antioxidant 3wt.%, monobasic acid 2wt.%.

[0033] Step (2): prepare activator B, add polybasic acid, dibasic acid, alcohol solvent into a beaker and heat and stir to dissolve, wherein polyacid, dibasic acid and alcohol solvent account for the weight percentage of activator B respectively: 9wt.%, 6wt.%, 85wt.%.

[0034] Step (3): Cool the mixture A in step (1) to 50-60°C.

[0035] Step (4): Add an organic amine and an activator B to the cooled mixture A, where...

Embodiment 3

[0037] Step (1): Prepare mixture A, add the following components to a container in turn, heat to 70°C and keep stirring until completely dissolved to obtain mixture A. The weight percentages of each component in the solder paste are: rosin 20wt. %, resin 5wt.%, high boiling point solvent 30wt.%, thixotropic agent 4wt.%, organic active agent 8wt.%, high temperature active agent 1wt.%, antioxidant 3wt.%, monobasic acid 2wt.%.

[0038] Step (2): prepare activator B, add polybasic acid, dibasic acid, alcohol solvent into a beaker and heat and stir to dissolve, wherein the weight percent of polybasic acid, dibasic acid and alcohol solvent respectively accounting for activator B is 12wt.%, 5wt.%, 83wt.%.

[0039] Step (3): Cool the mixture A in step (1) to 50-60°C.

[0040] Step (4): Add an organic amine and an activator B to the cooled mixture A, wherein the weight percentages of each component in the soldering paste are: 3wt.% of the organic amine and 24wt.% of the activator, and...

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Abstract

The invention provides a high-lead semiconductor flux paste. The high-lead semiconductor flux paste comprises the following components in percentage by weight: 20-30% of rosin, 1-5% of resin, 20-30% of a high-boiling-point solvent, 2-4% of a thixotropic agent, 6-8% of an organic active agent, 1-3% of a high-temperature active agent, 1-3% of an anti-oxidant, 1-2% of monobasic acid, 1-3% of organic amine and 19.5-25% of an activator. The invention further provides a preparation method for the high-lead semiconductor flux paste and the high-lead semiconductor flux paste. The flux paste is relatively high in activity, is great in rate of expansion and is strong in compatibility with a high-lead alloy; and the prepared high-lead semiconductor flux paste is suitable for encapsulating and welding a large-power semiconductor apparatus which works under a high-temperature environment, is good in compatibility with gold, copper and silver, is great in welding strength, is high in insulation resistance of a welded product, and is strong in reliability.

Description

technical field [0001] The invention relates to the field of semiconductor device packaging, in particular to a high-lead semiconductor solder paste, a preparation method and solder paste. Background technique [0002] Semiconductor devices are the main and important components of electronic products. The semiconductor assembly generally referred to can be defined as: using film technology and micro-connection technology to combine semiconductor chips (chips) and frames (leadframes) or substrates (sulbstrate) or plastics. The conductor part of the film or printed circuit board is connected to lead out the wiring pins, and is potted and fixed by a plastic insulating medium to form an overall three-dimensional structure. [0003] The life of electronic products depends largely on the soldering conditions of semiconductor devices. The high life of electronic products requires the products to be able to withstand harsh environments such as high and low temperatures and high humi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/363B23K35/40
CPCB23K35/3612B23K35/362B23K35/40
Inventor 陈林
Owner 深圳市爱汶斯特科技有限公司
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