Flip chip type semiconductor packaging structure

Abstract

The invention discloses a flip chip type semiconductor packaging structure which comprises an integrated circuit chip (23), a lead frame (25) and a group of metal projections (24A-24E). The group of metal projections is implanted on a surface contact pad which is reserved on the main surface of the integrated circuit chip. The lead frame is provided with a plurality of pins (25A-25C) which are insulated from one another. The pins extend according to an arrangement layout of the metal projections which output the same signal. A heat radiating block (21) with a recessed trough is arranged below the integrated circuit chip. The integrated circuit chip is integrally embedded into the recessed trough and is electrically connected with the lead frame through the metal projections. High-heat-conductivity insulating pouring sealant is filled between the chip and the frame. A directional flip chip type structure in which the main surface of the integrated circuit chip is arranged at the upper part is formed. A molding compound (26) packages the directional flip chip type structure. The flip chip type semiconductor packaging structure improves heat radiating capability and heat reliability of the integrated circuit chip and can be used for packaging a high-power chip and a high-density integrated circuit.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a flip-chip semiconductor packaging structure, which can be used for packaging high-power chips and high-density integrated circuits. Background technique [0002] Integrated circuit chips generate a lot of heat during operation, and the low thermal conductivity of the molding compound makes it difficult for the encapsulated chip to dissipate heat. Therefore, it is necessary to design its packaging structure to reduce thermal resistance. [0003] In traditional packaging, wire bonding is generally used to electrically connect the chip to the lead frame. This connection method is easy to increase the conduction resistance and thermal resistance between the chip and the lead, and the lead is also easy to break. [0004] Flip-chip packaging is to turn the chip upside down on the lead frame or substrate, and the metal bumps on the chip make the electrical connection b...

AI Technical Summary

Problems solved by technology

Therefore, the middle area of ​​the main surface of the chip is occupied by the lead frame, and the heat on the chip is conducted to the heat sink through the metal bump to provide a high thermal conductivity channel. Heat is conducted almost exclusively to the lead frame and molding compound

[0007] In addition, in flip-chip packaging, due to the thermal expansion coefficient mismatch between the chip and the lead frame, the bumps on the chip will generate thermal stress and strain, and the accumulated strain energy will cause the bumps to crack and break, resulting in package failure.

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