Barrel-shaped solder ball redistribution packaging structure for GSIC (Grand Scale Integration Circuit)

A technology of large-scale integrated circuits and barrel-shaped solder balls, which is applied in the direction of circuits, electrical components, and electrical solid-state devices. It can solve the problems of package thickness and area reduction, and achieve volume reduction, cost saving, and warpage relief. Effect

Inactive Publication Date: 2016-10-26
TIANJIN UNIV
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The reduction of package thickness and area makes the thermomechanical problems of this package form more prominent

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Barrel-shaped solder ball redistribution packaging structure for GSIC (Grand Scale Integration Circuit)
  • Barrel-shaped solder ball redistribution packaging structure for GSIC (Grand Scale Integration Circuit)
  • Barrel-shaped solder ball redistribution packaging structure for GSIC (Grand Scale Integration Circuit)

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] The process of conventional redistribution packaging technology is as follows: first, place the active surface of the die on the substrate and encapsulate it with epoxy resin; then remove the substrate material; redistribution process, that is, rearrange signal lines, power lines and ground lines ; After implanting spherical solder balls; Finally, the individual chips are cut and opened.

[0018] In order to match the conventional redistribution packaging process, the barrel-shaped solder balls should be designed and produced according to the parameters of the original spherical solder balls, such as the opening of the solder balls, the height of the solder balls, and the material of the solder balls. The upper and lower parts of the barrel-shaped solder ball are two hemispheres, and the solder ball openings at the upper and lower ends must match the original process flow, that is, keep the solder ball opening of the barrel-shaped solder ball consistent with the solder b...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a barrel-shaped solder ball redistribution packaging structure for a GSIC (Grand Scale Integration Circuit), and the structure comprises an RCP plastic packaging material, a bare chip, a dielectric layer, an RDL bonding pad, a solder ball, a PCB bonding pad, and a PCB substrate. The solder ball is a barrel-shaped solder ball, wherein the upper and lower parts of the solder ball are respectively one part of two hemispheres, and the central part is a cylinder. The whole solder ball is shaped like a barrel. The structure improves the thermal mechanical reliability.

Description

technical field [0001] The invention belongs to the field of semiconductor packaging, is mainly applied to the packaging of VLSI chips, and in particular relates to a redistribution packaging structure with barrel-shaped geometry solder balls. Background technique [0002] With the increasing trend of miniaturization and multi-functionality, chip packaging has also developed from the previous Ball Grid Array (BGA) packaging to Wafer Level Package (WLP) packaging, while the traditional fan-in WLP packaging form The number of solder balls is restricted, and the fan-out WLP package can well solve the problem of the number of solder balls and the pitch. Redistributed chip packaging (RCP) is a kind of fan-out WLP package. Compared with BGA package, the thickness and area of ​​the package are greatly reduced, and it is a promising future packaging technology. [0003] The reduction in package thickness and area makes the thermomechanical problems of this package form more promine...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/488H01L21/60
CPCH01L23/488H01L24/06H01L24/14H01L2224/0601H01L2224/0605H01L2224/065H01L2224/1401H01L2224/1405H01L2224/145H01L2224/16
Inventor 肖夏曹一凡
Owner TIANJIN UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap