EMI suppression structure and suppression method based on resistive short circuit via holes

Abstract

The invention discloses an EMI suppression structure and a suppression method based on resistive short circuit via holes. The resistive short circuit via holes are implanted into a chip packaging substrate or a printed circuit board, the substrate at least includes a layer of medium and two opposite metal layers, the resistive short circuit via holes deposit resistive materials in boreholes and are filled with metal, all the metal layers form electrical connection, and an energy absorption path is provided for the EMI noise current. The EMI suppression structure and the suppression method can be applicable to EMI radiation suppression of chip packaging and the printed circuit board; and compared with the prior art, the problem of high-frequency radiation suppression is effectively solved, and huge application values are achieved in the EMI design field of high-speed packaging and the printed circuit boards.

Description

technical field [0001] The invention relates to the technical field of electromagnetic interference suppression for chip packaging and printed circuit boards, in particular to an EMI (Electromagnetic Interference, EMI) suppression structure and method based on resistive short circuit vias. Background technique [0002] With the rapid increase of data transmission rate and operating frequency in high-speed digital systems, especially the increase in the international demand for next-generation mobile communications, effective suppression of high-frequency EMI has become an important technical problem faced by current electronic products. Both the Federal Communications Commission of the United States and the International Electrotechnical Commission have clearly stipulated the maximum electric field limits radiated by different types of electronic equipment at 3 meters and 10 meters to regulate the radiation of electronic products. Therefore, a large number of researchers and...

AI Technical Summary

Problems solved by technology

However, common-mode filters and electromagnetic bandgap structures often rely on additional structural design, which not only increases the cost but also limits the further improvement of wiring density, making it difficult to be widely used

At the same time, there is an equivalent series resistance in the decoupling capacitor, and there is a serious parasitic inductance effect in the short-circuit via, so that these two commonly used technologies have no inhibitory effect on high-frequency electromagnetic radiation.

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