Protection glue for electronics and preparation method thereof

A technology of electronic protection and butyl rubber, applied in the direction of polymer adhesive additives, non-polymer adhesive additives, adhesive additives, etc., can solve aging resistance, poor stability, and products with pungent odor , secondary environmental pollution and other issues, to achieve good application prospects, odorless and environmentally friendly preparation methods, and low cost effects

Inactive Publication Date: 2017-07-25
合肥仁德电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The demand for high-performance electronic protective glue is increasing day by day, and the application prospect is very broad. For the current fast-growing electronics industry, the existing electronic protective glue usually uses polyvinyl chloride as raw material, which is costly and the manufactured products are

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] The electronic protective adhesive of the present embodiment includes the following raw materials in parts by weight:

[0026] 30 parts of butyl rubber, 5 parts of polyisobutylene, 10 parts of butylated amino resin, 20 parts of butyl acetate, 10 parts of epoxy modified silicone resin, 5 parts of magnesium hydroxide, 30 parts of 325 mesh talcum powder, paraffin wax 5-serving.

[0027] The preparation method of the electronic protective adhesive of the present embodiment is characterized in that it comprises the following steps:

[0028] Step 1: Put the weighed butyl rubber, butylated amino resin, butyl acetate, and epoxy-modified silicone resin into a sealed rubber mixer for mixing until the temperature reaches 140°C, then add polyisobutylene , mixed for 10 minutes to form a fluid masterbatch, and poured out of the sealed rubber mixer;

[0029] Step 2: Put the masterbatch refined in Step 1, talcum powder, flame retardant, and paraffin into a sealed rubber mixer for mix...

Embodiment 2

[0032] The electronic protective adhesive of the present embodiment includes the following raw materials in parts by weight:

[0033] 50 parts of butyl rubber, 15 parts of polyisobutylene, 30 parts of butylated amino resin, 40 parts of butyl acetate, 30 parts of epoxy modified silicone resin, 15 parts of monoammonium phosphate, 60 parts of 325 mesh talcum powder, 10 parts of paraffin wax share.

[0034] The preparation method of the electronic protective adhesive of the present embodiment comprises the following steps:

[0035] Step 1: Put the weighed butyl rubber, butylated amino resin, butyl acetate, and epoxy-modified silicone resin into a sealed rubber mixer for mixing until the temperature reaches 160°C, and then add polyisobutylene , mixed for 20 minutes to form a fluid masterbatch, and poured out of the sealed rubber mixer;

[0036] Step 2: Put the masterbatch refined in Step 1, talcum powder, flame retardant, and paraffin into a sealed rubber mixer for mixing until t...

Embodiment 3

[0039] The electronic protective adhesive of the present embodiment includes the following raw materials in parts by weight:

[0040] 40 parts of butyl rubber, 10 parts of polyisobutylene, 20 parts of butylated amino resin, 25 parts of butyl acetate, 20 parts of epoxy modified silicone resin, 10 parts of ammonium chloride, 45 parts of 325 mesh talcum powder, paraffin wax 8 servings.

[0041] The preparation method of the electronic protective adhesive of the present embodiment comprises the following steps:

[0042] Step 1: Put the weighed butyl rubber, butylated amino resin, butyl acetate, and epoxy-modified silicone resin into a sealed rubber mixer for mixing until the temperature reaches 150°C, then add polyisobutylene , mixed for 15 minutes to form a fluid masterbatch, and poured out of the sealed rubber mixer;

[0043] Step 2: Put the masterbatch refined in Step 1, talcum powder, flame retardant, and paraffin into a sealed rubber mixer for mixing until the temperature r...

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PUM

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Abstract

The invention provides protection glue for electronics. The protection glue is characterized in that the protection glue comprises the following raw materials in parts by weight: 30-50 parts of butyl rubber, 5-15 parts of polyisobutylene, 10-30 parts of butyl etherified amino resin, 20-40 parts of butyl acetate, 10-30 parts of epoxy-modified organic silicon resin, 5-15 parts of a fire retardant, 30-60 parts of talc powder, and 5-10 parts of paraffin. The protection glue for electronics has good resistance to light, heat and humidity, stable performance without easy cracking, low cost, easily available raw materials, environmental protection without odor, simple preparation, and good application prospects.

Description

technical field [0001] The invention relates to the technical fields of chemical industry and electronics, in particular to an electronic protective glue and a preparation method thereof. Background technique [0002] With the advancement of science and technology, integrated circuits have developed by leaps and bounds, and the emergence of various smart chips has greatly changed human production and life. In order to ensure that circuit boards, electronic devices, etc. maintain good insulation performance during use, avoid external impact machine damage, will not be affected by machinery, heat, humidity, dust, oily smoke, etc., and improve performance and stability parameters, it is necessary to These devices are coated with a protective coating or packaged. Electronic protective glue is liquid before use, which is easy to pour and use. It is often used for bonding, sealing, potting and coating protection of electronic components and optoelectronic devices. It can prevent ...

Claims

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Application Information

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IPC IPC(8): C09J123/22C09J11/08C09J11/06C09J11/04
CPCC09J123/22C08K2201/003C08L2201/02C08L2201/08C08L2203/20C08L2205/02C08L2205/035C09J11/04C09J11/06C09J11/08
Inventor 李阳
Owner 合肥仁德电子科技有限公司
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