Method for printing PCB solder resist layer with heat-set ink

Abstract

The invention provides a method for printing a PCB solder resist layer with heat-set ink. The method comprises the following steps of: a, polishing a PCB to remove foreign matters such as oxide and garbage on the surface of the PCB; b, making a silk screen plate, coating the silk screen plate with a layer of photosensitive resist, putting a film on the silk screen plate to be exposed, and transferring a pattern to the silk screen plate and performing development; c, installing the silk screen plate; d, deploying the heat-set ink, adding a curing agent and a diluents to the heat-set ink and uniformly stirring; e, printing: enabling a semi-automatic printing press to print the deployed heat-set ink on the surface of the PCB by using a scraper; f, baking: placing the printed PCB into an oven to be baked in order that the heat-set ink is cured to form the solder resist layer; and g, checking the PCB. The heat-set ink is printed on the PCB surface by the silk screen plate, and is directly heated and cured to form the solder resist layer. The method can achieve an effect that completely satisfies the quality requirement of a solder resist layer obtained by a traditional process, and can reduce production cost and can improve the production efficiency.

Description

technical field [0001] The invention relates to the field of PCB printing, and specifically discloses a method for printing a PCB solder mask with thermosetting ink. Background technique [0002] The full name of PCB is printed circuit board. PCB production mainly includes cutting, drilling, copper sinking, image transfer, graphic plating, film fading, etching, green oil, characters, gold-plated fingers, forming, testing and final inspection. [0003] The traditional image transfer process first grinds the PCB to make a screen plate, prints a layer of photosensitive ink on the PCB through the screen plate, pre-baked and rests, and places the film with the designed graphics on the PCB. Exposing on the machine position, and then spraying the developer to remove the redundant graphics to obtain the surface solder mask. The traditional image transfer method requires the steps of printing photosensitive ink, pre-baking, printing, stilling, alignment, exposure, and development ev...

AI Technical Summary

Problems solved by technology

The traditional image transfer method requires the steps of printing photosensitive ink, pre-baking, printing, stilling, alignment, exposure, and development every time a PCB board is printed. Among them, printing machines, pre-oven, exposure machines, and developing machines need to be used. At the same time, each device needs to consume corresponding water and electricity, labor costs, materials and time, not only the production time of PCB is long, but also the cost is high