Full-automatic bar bonding unit for bonding crystal bars

Abstract

The invention provides a full-automatic bar bonding unit for bonding crystal bars. The full-automatic bar bonding unit for bonding the crystal bars comprises a material base feeding mechanism, a crystal bar feeding mechanism, a splitting mechanical arm, a jig return line, bar bonding machines, a truss mechanical arm, a pre-curing assembly line and a digital curing library, wherein the splitting mechanical arm is used for grabbing material bases provided by the material base feeding mechanism, the two ends of the jig return line are connected to the splitting mechanical arm and the crystal bar feeding mechanism in a butt joint mode respectively, a sliding rail of the truss mechanical arm is arranged above the feeding end of the bar bonding machines and above the crystal bar feeding mechanism, the feeding ends of the pre-curing assembly line correspond to the discharging ends of the bar bonding machines, the discharging end of the pre-curing assembly line is located below the splitting mechanical arm, and the feeding end of the digital curing library is connected to the splitting mechanical arm in a in butt joint mode. The full-automatic bar bonding unit has the advantages that automation and manpower minimization of bar bonding procedures can be realized, the labor intensity of workers can be reduced, and meanwhile, the production efficiency can be greatly improved.

Description

technical field [0001] The invention belongs to the technical field of crystal rod processing, and in particular relates to a fully automatic sticking unit for bonding crystal rods. Background technique [0002] With the technological development of the photovoltaic industry, manufacturers have higher and higher requirements for the automation of related production equipment. In the production process of silicon wafers, the bonding process of ingots is an essential step in the production process, but it is also a link with a relatively low degree of automation. At present, most manufacturers rely on manual labor to complete the ingot bonding process. The degree of automation is low. The weight of the tooling and the bonded ingot can reach 100KG. The handling process is laborious and time-consuming, with low work efficiency and high labor intensity. . Contents of the invention [0003] In view of this, the present invention aims to propose a fully automatic rod sticking u...

AI Technical Summary

Problems solved by technology

In the production process of silicon wafers, the bonding of crystal rods is an essential step in the production process, but it is also a link with a relatively low degree of automation.

At present, most manufacturers rely on manual labor to complete the ingot bonding process. The degree of automation is low. The weight of the tooling and the bonded ingot can reach 100KG. The handling process is laborious and time-consuming, with low work efficiency and high labor intensity.

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