High covering and high adhesion resin composition for electronic mylar

A resin composition, high adhesion technology, applied in ink, household utensils, applications, etc., can solve the problems that are difficult to achieve high covering, high gloss and high adhesion at the same time, achieve high hardness, high covering performance, high white The effect of whiteness and gloss

Inactive Publication Date: 2017-08-08
CHUZHOU JINQIAO TEXAS NEW MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Due to the continuous innovation of the production process, it is currently proposed to meet the high-gloss, high-coverage white ink on its FP

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0019] Example 1

[0020] The raw material composition of each weight part of the resin composition is: 34 parts of PBT (SABIC 325M-54018), 3 parts of Korean SK ES-100 polyester resin, 1 part of dispersant (EFKA4560), 1 part of Grace matting powder ED2, 1 part BYK333 leveling agent, 2 parts wax powder, 2 parts trimethylbenzene, 1 part tetramethylbenzene, 50 parts titanium dioxide, 0.5 parts Hennaki HY brightener.

Example Embodiment

[0021] Example 2

[0022] The raw material composition of each weight part of the resin composition is: 34 parts of PBT (SABIC 325M-54018), 3 parts of Korean SK ES-100 polyester resin, 1 part of dispersant (EFKA4560), 1 part of Grace matting powder ED2, 1 part BYK333 leveling agent, 2 parts wax powder, 2 parts trimethylbenzene, 1 part tetramethylbenzene, 50 parts titanium dioxide, 0.5 parts Hennaki HY brightener.

Example Embodiment

[0023] Example 3

[0024] The raw material composition of each weight part of the resin composition is: 34 parts of PBT (SABIC 325M-54018), 3 parts of Korean SK ES-100 polyester resin, 1 part of dispersant (SN 5040), Evonik Degussa OK500 matting 1 part of Efka 3600 leveling agent, 2 parts of wax powder, 2 parts of trimethylbenzene, 1 part of tetramethylbenzene, 50 parts of titanium dioxide, 0.5 parts of microspectral technology WPPV-569 brightener.

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PUM

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Abstract

The invention discloses a high covering and high adhesion resin composition for electronic mylar. The composition is prepared from the following components by weight: 30-40 parts of PBT, 1-5 parts of South Korea SK ES-100 polyester resin, 0.2-5 parts of a dispersing agent, 0.2-5 parts of a flatting agent, 0.2-5 parts of a leveling agent, 0.5-5 parts of wax powder, 0.5-5 parts of trimethylbenzene, 0.2-5 parts of tetramethylbenzene, 40-60 parts of titanium dioxide, and 0.1-2 parts of a brightening agent. The high covering and high adhesion resin composition for electronic mylar provided by the invention adopts two resins for compounding, and through mutual coordination of the two resins and under the cooperation of other components, the resin composition coating film can have high covering performance, high hardness and high adhesion, and at the same time have high whiteness and gloss.

Description

technical field [0001] The invention belongs to the field of ink resin compositions, and in particular relates to an electronic Mylar high-coverage and high-adhesion resin composition and a preparation method thereof. Background technique [0002] Mylar sheet generally refers to die-cutting (DIECUT) according to the requirements of the drawing or specified punching into a sheet. There are two types of Mylar, metal and non-metallic. Metal Mylar sheets are commonly used for copper foil Mylar and aluminum foil Mylar. Membrane switch or surface protection of electrical and electronic products, or partial insulation. There are many colors of mylar sheets, commonly used are transparent, white, black, and other colors can be printed according to specified requirements. Mylar sheet has the characteristics of high dielectric strength, high voltage resistance, resistance to moisture, gas, high heat and chemical substances, low shrinkage, not easy to embrittle and wear-resistant. ...

Claims

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Application Information

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IPC IPC(8): C09D11/104C09D11/03
CPCC09D11/104C09D11/03
Inventor 王景泉
Owner CHUZHOU JINQIAO TEXAS NEW MATERIALS CO LTD
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