High covering and high adhesion resin composition for electronic mylar
A resin composition, high adhesion technology, applied in ink, household utensils, applications, etc., can solve the problems that are difficult to achieve high covering, high gloss and high adhesion at the same time, achieve high hardness, high covering performance, high white The effect of whiteness and gloss
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Embodiment 1
[0020] The raw materials of each weight part of the resin composition are: 34 parts of PBT (Sabbasic 325M-54018), 3 parts of Korean SK ES-100 polyester resin, 1 part of dispersant (EFKA4560), 1 part of Grace matting powder ED2, 1 part of BYK333 leveling agent, 2 parts of wax powder, 2 parts of trimethylbenzene, 1 part of tetramethylbenzene, 50 parts of titanium dioxide, 0.5 part of Heng Naiqi HY brightener.
Embodiment 2
[0022] The raw materials of each weight part of the resin composition are: 34 parts of PBT (Sabbasic 325M-54018), 3 parts of Korean SK ES-100 polyester resin, 1 part of dispersant (EFKA4560), 1 part of Grace matting powder ED2, 1 part of BYK333 leveling agent, 2 parts of wax powder, 2 parts of trimethylbenzene, 1 part of tetramethylbenzene, 50 parts of titanium dioxide, 0.5 part of Heng Naiqi HY brightener.
Embodiment 3
[0024] The raw materials of each part by weight of the resin composition are: 34 parts of PBT (SAABIC 325M-54018), 3 parts of Korean SK ES-100 polyester resin, 1 part of dispersant (SN 5040), Evonik Degussa OK500 matting 1 part of Efka 3600 leveling agent, 2 parts of wax powder, 2 parts of trimethylbenzene, 1 part of tetramethylbenzene, 50 parts of titanium dioxide, 0.5 part of micro-spectrum technology WPPV-569 brightener.
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