High covering and high adhesion resin composition for electronic mylar

The invention discloses a high covering and high adhesion resin composition for electronic mylar. The composition is prepared from the following components by weight: 30-40 parts of PBT, 1-5 parts of South Korea SK ES-100 polyester resin, 0.2-5 parts of a dispersing agent, 0.2-5 parts of a flatting agent, 0.2-5 parts of a leveling agent, 0.5-5 parts of wax powder, 0.5-5 parts of trimethylbenzene, 0.2-5 parts of tetramethylbenzene, 40-60 parts of titanium dioxide, and 0.1-2 parts of a brightening agent. The high covering and high adhesion resin composition for electronic mylar provided by the invention adopts two resins for compounding, and through mutual coordination of the two resins and under the cooperation of other components, the resin composition coating film can have high covering performance, high hardness and high adhesion, and at the same time have high whiteness and gloss.