High covering and high adhesion resin composition for electronic mylar

A resin composition, high adhesion technology, applied in ink, household utensils, applications, etc., can solve the problems that are difficult to achieve high covering, high gloss and high adhesion at the same time, achieve high hardness, high covering performance, high white The effect of whiteness and gloss

Inactive Publication Date: 2017-08-08
CHUZHOU JINQIAO TEXAS NEW MATERIALS CO LTD
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AI-Extracted Technical Summary

Problems solved by technology

[0003] Due to the continuous innovation of the production process, it is currently proposed to meet the high-gloss, high-coverage white ink on its FP...
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Abstract

The invention discloses a high covering and high adhesion resin composition for electronic mylar. The composition is prepared from the following components by weight: 30-40 parts of PBT, 1-5 parts of South Korea SK ES-100 polyester resin, 0.2-5 parts of a dispersing agent, 0.2-5 parts of a flatting agent, 0.2-5 parts of a leveling agent, 0.5-5 parts of wax powder, 0.5-5 parts of trimethylbenzene, 0.2-5 parts of tetramethylbenzene, 40-60 parts of titanium dioxide, and 0.1-2 parts of a brightening agent. The high covering and high adhesion resin composition for electronic mylar provided by the invention adopts two resins for compounding, and through mutual coordination of the two resins and under the cooperation of other components, the resin composition coating film can have high covering performance, high hardness and high adhesion, and at the same time have high whiteness and gloss.

Application Domain

Inks

Technology Topic

WaxTitanium dioxide +4

Examples

  • Experimental program(5)
  • Comparison scheme(4)

Example Embodiment

[0019] Example 1
[0020] The raw material composition of each weight part of the resin composition is: 34 parts of PBT (SABIC 325M-54018), 3 parts of Korean SK ES-100 polyester resin, 1 part of dispersant (EFKA4560), 1 part of Grace matting powder ED2, 1 part BYK333 leveling agent, 2 parts wax powder, 2 parts trimethylbenzene, 1 part tetramethylbenzene, 50 parts titanium dioxide, 0.5 parts Hennaki HY brightener.

Example Embodiment

[0021] Example 2
[0022] The raw material composition of each weight part of the resin composition is: 34 parts of PBT (SABIC 325M-54018), 3 parts of Korean SK ES-100 polyester resin, 1 part of dispersant (EFKA4560), 1 part of Grace matting powder ED2, 1 part BYK333 leveling agent, 2 parts wax powder, 2 parts trimethylbenzene, 1 part tetramethylbenzene, 50 parts titanium dioxide, 0.5 parts Hennaki HY brightener.

Example Embodiment

[0023] Example 3
[0024] The raw material composition of each weight part of the resin composition is: 34 parts of PBT (SABIC 325M-54018), 3 parts of Korean SK ES-100 polyester resin, 1 part of dispersant (SN 5040), Evonik Degussa OK500 matting 1 part of Efka 3600 leveling agent, 2 parts of wax powder, 2 parts of trimethylbenzene, 1 part of tetramethylbenzene, 50 parts of titanium dioxide, 0.5 parts of microspectral technology WPPV-569 brightener.

PUM

no PUM

Description & Claims & Application Information

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