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Copper Foil With Attached Carrier, Copper-Clad Laminate Using Same, Printed Circuit Board, Electronic Device, And Method For Manufacturing Printed Circuit Board

A technology with carrier copper foil and carrier, applied in electronic equipment, printed circuits, printed circuits, etc., can solve problems such as poor insulation of circuit patterns and residual copper particles

Inactive Publication Date: 2017-08-11
JX NIPPON MINING & METALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, even in printed wiring boards, if such an ultra-thin copper layer with a large outline (concave-convex, roughness) is used on a semiconductor package substrate required to form a particularly fine circuit pattern, undesired copper will remain during circuit etching. Necessary copper particles may cause problems such as poor insulation between circuit patterns

Method used

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  • Copper Foil With Attached Carrier, Copper-Clad Laminate Using Same, Printed Circuit Board, Electronic Device, And Method For Manufacturing Printed Circuit Board
  • Copper Foil With Attached Carrier, Copper-Clad Laminate Using Same, Printed Circuit Board, Electronic Device, And Method For Manufacturing Printed Circuit Board
  • Copper Foil With Attached Carrier, Copper-Clad Laminate Using Same, Printed Circuit Board, Electronic Device, And Method For Manufacturing Printed Circuit Board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0250] A polyimide film (Upilex-S film manufactured by Ube Industries, Ltd.; thickness: 35 μm) was installed in a vacuum apparatus, and plasma treatment was performed using oxygen after vacuum exhaust.

[0251] Next, a Cr layer of 10 nm was formed on one surface of the plasma-treated film by Cr sputtering. Afterwards, the Cr sputtered layer is processed in an oxygen atmosphere chamber to form chromium oxide on the surface to form an intermediate layer.

[0252] Next, Cu sputtering was performed on the surface of the Cr intermediate layer to form a Cu sputtering layer with a thickness of 5 μm. The sputtering conditions are set in the Ar gas using the Cu target, the discharge voltage is 500V, the discharge current is 15A, and the vacuum degree is 5×10 －2 Pa.

[0253] Next, on the surface of the 5 μm Cu sputtered layer, the following roughening treatment 1, roughening treatment 2, heat resistance treatment, chromate treatment, and silane coupling treatment were sequentially per...

Embodiment 2

[0298] After forming the ultra-thin copper layer of 5 μm Cu sputtering on the polyimide film carrier with the same steps, methods and conditions as in Example 1, the heat-resistant treatment of Example 1, chromate treatment, and Silane coupling treatment.

Embodiment 3

[0300] After forming a Cu sputtering layer of 1 μm on the polyimide carrier with the same steps, methods, and conditions as in Example 1, then, on a roll-to-roll continuous plating line, form a sputtering layer on the Cu sputtering layer by electroplating. The Cu plated layer of 2 μm was electroplated under the following conditions to form an ultra-thin copper layer with a total copper thickness of 3 μm, and to manufacture a copper foil with a carrier.

[0301] ·Electroplating Cu layer

[0302] Copper concentration: 30~120g / L

[0303] h 2 SO 4 Concentration: 20~120g / L

[0304] Cl concentration: 30~80mg / L

[0305] Concentration of dithiobis(3-sulfopropyl) disodium: 10~50mg / L

[0306] Polymers containing dialkylamine groups (weight average molecular weight 8500): 10~50mg / L

[0307] Electrolyte temperature: 20~80℃

[0308] Current density: 10~100A / dm 2

[0309] After forming the ultra-thin copper layer, the same roughening treatment 1, roughening treatment 2, heat-resist...

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Abstract

Provided is a copper foil with an attached carrier, said copper foil being suitable for fine-pitch pattern formation. Said copper foil is provided with the following, in this order: a carrier, i.e. a support; an intermediate layer; and an ultrathin copper layer. At least one side of said ultrathin copper layer has an Rz, as measured by a non-contact surface roughness tester, of 0.5 [mu]m or less.

Description

[0001] This application is a Chinese patent application number 201480012569.8, and the title of the invention is "copper foil with carrier, copper-clad laminate using it, printed wiring board, electronic machine, and manufacturing method of printed wiring board", and the application date is 2014 Divisional application of the Chinese invention patent application on March 4. technical field [0002] The present invention relates to a copper foil with a carrier, a copper-clad laminate using the same, a printed wiring board, an electronic device, and a method for manufacturing the printed wiring board. Background technique [0003] A printed wiring board is usually produced through a process of forming a conductive pattern on the copper foil surface by etching after bonding an insulating substrate and copper foil to form a copper-clad laminate. In recent years, with the miniaturization of electronic equipment and the increase in the demand for high performance, the high-density ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/08B32B15/20B32B27/28B32B33/00
CPCB32B15/01C25D1/04H05K1/09H05K3/025H05K2201/0355B32B15/08B32B15/20B32B27/281B32B33/00B32B2255/06B32B2255/205B32B2457/08
Inventor 坂口和彦佐佐木伸一
Owner JX NIPPON MINING & METALS CORP