Solvent-free double-component epoxy resin adhesive and preparation method and application thereof

A technology of epoxy resin glue and epoxy resin, which is applied in the direction of epoxy resin glue, adhesive additives, polymer adhesive additives, etc., can solve the problem of poor rotational stretching ability of chain segments, loss of cohesive force, and brittleness cracking peel strength and other issues, to achieve the effect of good shear resistance, excellent adhesion, high peel strength

Active Publication Date: 2017-08-11
江苏三木化工股份有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the cured product has poor toughness and high brittleness, resulting in low peel strength
The reason for its poor toughness is that there are many rigid benzene ring structures in epoxy resin, and the proportion of long-chain saturated carbon chain structure is low. Easy to brittle, low peel strength, easy to lose adhesion when encountering temperature changes

Method used

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  • Solvent-free double-component epoxy resin adhesive and preparation method and application thereof
  • Solvent-free double-component epoxy resin adhesive and preparation method and application thereof
  • Solvent-free double-component epoxy resin adhesive and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～ Embodiment 8

[0024] Preparation of a two-component epoxy resin adhesive and its use are shown in Table 1.

[0025] Table 1 Preparation of two-component epoxy resin adhesive raw material components and their proportions

[0026]

[0027]

[0028] 1. The preparation method of solvent-free two-component epoxy resin adhesive, the steps are as follows:

[0029] (1) Add polyether polyol N210, polyether polyol N220, and polyester polyol 1330 into the container according to the parts by weight in the above table 1, and stir at 80° C. for 15 min;

[0030] (2) Add isocyanate TDI to the reaction system of step (1) several times, stir at 80°C for 2h; add epoxy resin E-51, heat up to 95°C, stir for 2.5h, and the reaction is over to obtain a modified epoxy resin ,spare;

[0031] (3) Take the above modified epoxy resin and epoxy curing agent T31, mix and stir evenly in a ratio of 14:1, add 12 parts of acetone to adjust the viscosity, and prepare 8 parts of epoxy resins made from raw materials in ...

Embodiment 9

[0032] Embodiment 9 performance test, concrete steps are as follows:

[0033] 1. Polish the wooden substrate to make it smooth, and apply the epoxy resin adhesive prepared in the above examples 1 to 8 according to the amount of 2kg of glue per square meter, and wait for the solvent on the bonding surface to evaporate for a few minutes. Lay the adhesive surface together, compact it, and cure it at room temperature for 1 hour to have a high adhesive force, and 24 hours to reach the highest adhesive force;

[0034] The modified epoxy resin glue after curing was measured for the following properties:

[0035] (1) Shear strength; (2) Peel strength; (3) Adhesive strength of bonded wood boards after soaking in water for 120 hours at room temperature; (4) Adhesive strength of bonded glass plates after soaking in water for 240 hours at room temperature .

[0036] The specific inspection results are shown in Table 2:

[0037]

[0038] The results of the above performance tests sho...

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Abstract

The invention discloses a solvent-free double-component epoxy resin adhesive. The solvent-free double-component epoxy resin adhesive comprises epoxy resin, isocyanate, polyether polyol, polyester polyol and an epoxy curing agent. The solvent-free double-component epoxy resin adhesive has the advantages that the epoxy resin and the isocyanate are combined according to an optimized proportion obtained through a large amount of experimental screening to serve as the double-component matrix resin, the polyether polyol and the polyester polyol with long chains are used to improve the problem that rigid benzene ring chain segments are poor in rotating and stretching capacity, the optimal epoxy curing agent is used to allow the cured adhesive to have excellent toughness, and the adhesive is good in impact resistance and stretch resistance, less prone to brittle rupture, high in peel strength, good in shear resistance and capable of still keeping excellent adhesive force under high temperature; many defects in the prior art can be overcome, and good and unexpected technical effects are achieved.

Description

technical field [0001] The invention relates to an adhesive, in particular to a solvent-free two-component epoxy resin adhesive whose cured product has strong toughness, low brittleness and is difficult to peel off, and a preparation method thereof, belonging to the technical field of polymer materials. Background technique [0002] Epoxy resin adhesive is suitable for bonding a variety of substrates, with high adhesive strength, low curing shrinkage, good insulation and strong corrosion resistance, and has the advantages of simple construction process, high work efficiency, low energy consumption, low cost, etc. advantage. However, the cured product has poor toughness and high brittleness, resulting in low peel strength. The reason for its poor toughness is that there are many rigid benzene ring structures in epoxy resin, and the proportion of long-chain saturated carbon chain structure is low. It is easy to be brittle and has low peel strength, and it is easy to lose its...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/08
CPCC08L2201/08C08L2205/03C09J11/08C09J163/00C08L71/00C08L67/00C08L75/08
Inventor 蒋震惠正权周煊
Owner 江苏三木化工股份有限公司
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