Blood test chip and manufacture method thereof
A manufacturing method and chip technology, applied in the field of medical equipment, can solve the problems of high cost of use, low detection efficiency, single detection index, etc., and achieve the effects of convenient detection, shortening interval time, and eliminating blood sampling.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0036] Such as Figure 1~3 As shown, a blood test chip includes a carrier substrate 1, a conductive base layer 2 arranged on the carrier substrate 1, and an insulating adhesive layer 3 covering the conductive base layer 2; wherein the carrier substrate 1 is a silicon substrate, graphite An vinyl sheet or a silicon carbide substrate; the insulating adhesive layer 3 is provided with a probe through hole 4, and the probe through hole 4 is provided with a nano-metal probe 5 protruding from the surface of the insulating adhesive layer 3, and the nano-metal probe 5 includes a metal probe The needle body 51 and the thorn-like protrusion 52 distributed on the surface of the metal probe body 51, the thorn-like protrusion 52 and its surroundings are attached with antibody molecules 53 for detecting pathogens, and the antibody molecules 53 are DNA molecules, RNA molecules and immobilized enzyme molecules at least one of the
[0037] The metal probe body 51 includes a metal post 511 disp...
Embodiment 2
[0047] This embodiment provides a method for manufacturing the blood test chip described in Embodiment 1, which includes the following steps:
[0048] Step 1: Cleaning the surface of the carrier substrate 1, then coating the conductive base layer 2 and the photoresist layer in sequence, then exposing and developing under the irradiation of ultraviolet light, and using a metal etchant to remove the unexposed conductive base layer 2 , to form the required circuit pattern; wherein, the conductive base layer 2 is a conductive metal layer, preferably a gold layer or a copper layer, and the photoresist layer is preferably SU-8 photoresist;
[0049] Step 2, peeling off the photoresist layer, cleaning and drying, and then coating the insulating adhesive layer 3, and punching through the insulating adhesive layer 3 to obtain a chip substrate containing the probe through hole 4; wherein the insulating adhesive Layer 3 is a phenolic resin layer, an epoxy resin layer, a polyimide resin la...
PUM
Property | Measurement | Unit |
---|---|---|
Height | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com