Multi-spectral three-dimensional imaging system

A three-dimensional imaging, multi-spectral technology, applied in the field of spectral imaging, to achieve the effect of reducing stability, light weight and compact structure

Inactive Publication Date: 2017-08-25
ACAD OF OPTO ELECTRONICS CHINESE ACAD OF SCI
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AI Technical Summary

Problems solved by technology

However, there is no remote sensing instrument that can simultaneously acquire target multispectral information and three-dimensional three-dimensional information.

Method used

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  • Multi-spectral three-dimensional imaging system

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Embodiment

[0041] At present, various remote sensing instruments acquire target multispectral information and three-dimensional stereo information through separate multispectral cameras and stereo mapping cameras, which are too large and complex. Therefore, in order to meet the application requirements of aerial remote sensing, the present invention proposes a multi-spectral three-dimensional imaging system using filter arrays, which organically combines spectral imaging technology and stereoscopic imaging technology, and has the ability to comprehensively detect three-dimensional information and spectral characteristics of the target . Schematic diagram of the principle of 3D multispectral imaging figure 1 shown. The whole multi-spectral three-dimensional imaging system consists of an imaging objective lens 1 and three multi-spectral array detectors 2, 3, and 4 in sequence. The imaging objective lens 1 realizes the function of imaging the target; the multi-spectral area array detector...

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Abstract

The invention discloses a multi-spectral three-dimensional imaging system comprising: an imaging objective lens and three multi-spectral area array detectors. The imaging objective lens achieves the function of target imaging. The multi-spectral area array detectors achieve the target spectral field segmentation and record information of various spectral segments. The three multi-spectral area array detectors are placed at front view, direct view and rear view positions, respectively, automatically achieves the scanning in the heading direction by the use of movement of a remote sensing platform, obtains information of a target in the three angles of view, and then through follow-up reconstruction and processing operations, can obtain a ground three-dimensional image. At the same time, for each single multi-spectral area array detector, the complete spectral data of the target are obtained by using the platform for flight push-broom. The whole system can obtain the information of four dimensions including the target three-dimensional information and spectral characteristics. The system has the characteristics of high integration, compact structure, light weight, reliable operation and high stability, reduces the requirement of an instrument for platform attitude stability, and can meet the demand of aerial remote sensing application.

Description

technical field [0001] The invention relates to the technical field of spectral imaging, in particular to a multi-spectral three-dimensional imaging system. Background technique [0002] Install various effective sensors in the space carrier to obtain the information of the earth or other planetary surface, the surrounding atmosphere and the limited depth under the surface, and then use data processing technology to obtain the information people need. This whole set of technology is called space remote sensing. At present, there are no less than a hundred kinds of sensors used, and their wave bands range from X-rays, vacuum ultraviolet, visible light, near infrared, far infrared to microwave bands. [0003] Multispectral imaging technology is a remote sensing technology that appeared in the early 1960s. The selection of its band range and number of bands is directly related to the application target. By obtaining spectral information of several or more bands of ground objec...

Claims

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Application Information

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IPC IPC(8): G01J3/28G01J3/02G01C11/00G01C11/04H04N13/02
CPCG01J3/2823G01C11/00G01C11/04G01J3/0227G01J3/2803G01J2003/2826H04N13/243
Inventor 钱路路黄旻方煜赵宝玮刘晓旻
Owner ACAD OF OPTO ELECTRONICS CHINESE ACAD OF SCI
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