Processing method for improving second generation high-temperature super-conducting strip interlayer binding force

A technology of high-temperature superconducting tape and interlayer bonding force, applied in the usage of superconducting elements, equipment for manufacturing conductive/semiconducting layers, superconducting devices, etc., can solve the problems affecting the robustness of processing technology, layer Poor bonding force between layers, low bonding force between layers, etc.

Active Publication Date: 2017-08-29
上海翌曦科技发展有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Due to the significant differences in the physical properties of the materials in each layer, and the surfaces of the superconducting layer, the isolation layer, and the metal base tape are all atomically flat, the second-generation high-temperature superconducting tapes have poor interlayer bonding under stress conditions.
Studies have shown that using the existing second-generation high-temperature superconducting tape preparation process, the interlayer bonding force of the tape is one to two orders of magnitude lower than the axial tensile strength
In addition, there is a large inhomogeneity in the interlayer bonding force along the length of the strip
With the acceleration of the application process, people are increasingly aware that the weak interlayer bonding force of the second-generation high-temperature superconducting tape is a short board that limits its further application.
This also seriously affects the robustness of the subsequent processing technology, and there is currently no effective solution

Method used

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  • Processing method for improving second generation high-temperature super-conducting strip interlayer binding force
  • Processing method for improving second generation high-temperature super-conducting strip interlayer binding force
  • Processing method for improving second generation high-temperature super-conducting strip interlayer binding force

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Effect test

Embodiment 1

[0034] This embodiment relates to a preparation method for improving the interlayer bonding force of the second-generation high-temperature superconducting tape, and the method includes the following steps:

[0035] 1) Etching process: select the structure as CeO 2 / MgO / Y 2 o 3 / Al 2 o 3 / C276 Textured flexible tape, on CeO 2 The oxide layer is etched; the etching technology is laser etching, the laser can provide laser with a wavelength in the ultraviolet band, the diameter of the laser spot is less than 2 microns, the laser etching frequency is 10 Hz, and the moving speed of the laser spot is 20 mm / s; Optical microscope photographs of the eclipse area, such as Figure 5 shown;

[0036] 2) Superconducting thin film deposition process: Deposit a superconducting layer on the surface of the textured flexible strip obtained in step 1), the process of depositing the superconducting layer is physical vapor deposition technology, and the material of the superconducting layer i...

Embodiment 2

[0038] This embodiment relates to a preparation method for improving the interlayer bonding force of the second-generation high-temperature superconducting tape, and the method includes the following steps:

[0039] 1) Etching process: select the structure as LaMnO 3 / MgO / Y 2 o 3 / Al 2 o 3 / SS textured flexible tape, for LaMnO 3 The oxide layer is etched; the etching technology is laser etching;

[0040] 2) Superconducting film deposition process: Deposit a superconducting layer on the surface of the textured flexible strip obtained in step 1), the process of depositing the superconducting layer is chemical vapor deposition technology, and the material of the superconducting layer is Gd 0.5 Y 0.5 Ba 2 Cu 3 o 7, step 1) does not affect the optimized process parameters for depositing the superconducting layer, and the deposition process is the same as that of the substrate without surface etching. The performance test result shows that the critical delamination stress ...

Embodiment 3

[0042] This embodiment relates to a preparation method for improving the interlayer bonding force of the second-generation high-temperature superconducting tape, and the method includes the following steps:

[0043] 1) Etching process: select the structure as CeO 2 / YSZ / Y 2 o 3 / NiW textured flexible tape, on CeO 2 The oxide layer is etched; the etching technique is chemical etching;

[0044] 2) Superconducting film deposition process: Deposit a superconducting layer on the surface of the textured flexible strip obtained in step 1), the process of depositing the superconducting layer is chemical vapor deposition technology, and the material of the superconducting layer is Gd 0.5 Y 0.5 Ba 2 Cu 3 o 7 with a molar content of 5% BaZrO 3 The composite superconductor; step 1) does not affect the optimized process parameters for depositing the superconducting layer, and the deposition process is the same as that of the substrate without surface etching. The performance test ...

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Abstract

The invention provides a processing method for improving second generation high-temperature super-conducting strip interlayer binding force. The processing method comprises the following steps of taking a textured flexible strip as the base material, performing etching on an oxide layer on the surface of the strip, and controlling etching depth, width and patterns; and adopting the etched textured flexible strip to perform superconducting thin film deposition. Compared with the prior art, the processing method has the following beneficial effects: 1, the interlayer binding force of the second generation high-temperature super-conducting strip obtained by the preparation method is improved by more than one time, while the current-carrying capability attenuation is less than 20%; and 2, the second generation high-temperature super-conducting strip prepared by the preparation method has no influence to the structure and the preparation process of the subsequently prepared superconducting thin film.

Description

technical field [0001] The invention relates to a processing method for improving the bonding force between layers of a second-generation high-temperature superconducting strip, and belongs to the technical field of preparation of the second-generation high-temperature superconducting strip. Background technique [0002] The second-generation high-temperature superconducting tape is a multi-layer structure, including four main parts: protective layer, superconducting layer, isolation layer and flexible base tape. The superconducting layer and isolation layer are oxide ceramics, and the protective layer and flexible base band are metal materials. During the preparation and application of the second-generation high-temperature superconducting tape, the tape experiences complex stress-strain, cold and heat cycles, bending, twisting, stretching, and clamping force, etc. Due to the significant differences in the physical properties of the materials in each layer, and the surface...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B12/06H01B13/00
CPCH01B12/06H01B13/00H01B13/0026Y02E40/60
Inventor 赵跃张智巍金之俭
Owner 上海翌曦科技发展有限公司
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