High-power laser diode array throttling micro-evaporative refrigeration heat sink

Abstract

The invention discloses a high-power laser diode array throttling micro-evaporation refrigeration heat sink. The high-power laser diode array throttling micro-evaporation refrigeration heat sink at least comprises a heat sink upper plate and a heat sink lower plate which are overlapped; a plurality of upper strip-shaped grooves are formed in the bottom surface of the heat sink upper plate; a plurality of lower strip-shaped grooves which communicate with the upper strip-shaped grooves in a one-to-one correspondence manner are formed in the top surface of the heat sink lower plate; each upper strip-shaped groove and the corresponding lower strip-shaped groove are staggered and communicate with each other to form a single flow path; the flowing directions of cooling liquid in each two adjacent flow paths are opposite; the top surface of the heat sink upper plate is a working surface for dissipating heat of a high-power laser diode array; the cooling efficiency of the heat sink can be improved effectively; uniformity of cooling of the heat sink is improved; the circumstance that the working efficiency is low due to uneven temperature of the high-power laser diode array is avoided; normal and efficient operation of the high-power laser diode array is guaranteed; and meanwhile, the high-power laser diode array throttling micro-evaporation refrigeration heat sink is high in structural precision and convenient to manufacture.

Description

technical field [0001] The invention relates to the field of laser cooling, in particular to a high-power laser diode array throttling micro-evaporation refrigeration heat sink. Background technique [0002] Micro miniature J-T Refrigerator (MMR) heat sink is a miniaturized refrigeration device made using the principles of vapor compression, throttling evaporation, and phase change heat absorption, including a micro compressor, an air-cooled condenser , throttling elements, micro-evaporation chamber and other components. It is specially used for electronic components with small heating area and high heat flux density, especially high-power laser diode (Laser Diode: LD) heat dissipation. Compared with the traditional LD ​​microchannel liquid-cooled heat sink, using the latent heat of phase change of the coolant, it can achieve a large amount of heat exchange and high heat dissipation density with a small mass and flow of the coolant; When the heat absorption is changed, the...

AI Technical Summary

Problems solved by technology

With the development of high-power laser technology, LD with higher power and higher heat flux density has been developed, and the traditional liquid-cooled microchannel single-phase heat transfer cooling can no longer meet the requirements; and due to the poor uniformity of heat sink cooling, This leads to uneven cooling of the high-power laser diode array, which is not conducive to the normal and efficient operation of the overall high-power laser diode array, and the manufacturing accuracy is low, making it difficult to manufacture high-precision heat sinks

[0003] Therefore, in order to solve the above problems, there is a need for a high-power laser diode array throttling micro-evaporative cooling heat sink, which can effectively improve the cooling efficiency of the heat sink, and improve the uniformity of thermal cooling and avoid uneven temperature of the high-power laser diode array As a result, the work efficiency is low, ensuring the normal and high-efficiency operation of the high-power laser diode array; at the same time, the structural precision is high and the preparation is convenient

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