High flame retardant and high transparency polyimide film and preparation method thereof

A polyimide film and transparency technology, which is applied in the field of high flame retardant and high transparency polyimide film and its preparation, can solve the problems of poor light transmittance of the film, unable to meet the colorless and high transparency of the film, etc. Effects of improved processability, excellent thermal stability, improved mechanical properties and heat resistance

Active Publication Date: 2018-12-28
HUBEI DINGLONG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, due to the presence of conjugated aromatic ring structures on the main chain of traditional aromatic polyimides, it is easy to form intramolecular and intermolecular charge transfer complexes, resulting in

Method used

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  • High flame retardant and high transparency polyimide film and preparation method thereof
  • High flame retardant and high transparency polyimide film and preparation method thereof
  • High flame retardant and high transparency polyimide film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] 1) Clean all the glass instruments to be used in the experiment and dry them for later use. Add 0.0121g (0.125mmol) 4-aminophenyl-3,5 -Diethyl-4-aminophenyl-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-phosphorylethane (ADADOPPE) and 1.0980g (4.875mmol) 2-(4- Aminophenyl)-5-aminobenzoxazole (AAPBO), then add 14.9g N,N-dimethylacetamide (DMAc) solvent, stir at room temperature until ADADOPPE and AAPBO are all dissolved; The temperature is maintained at 20°C;

[0033] 2) After the dissolution is completed, quickly add 2.6024g (5mmol) bisphenol A diether dianhydride (BPADA) into the three-necked flask, and the total solid content is 20% (the total solid content is m ADADOPPE+AAPBO+BPADA / m ADADOPPE+AAPBO+BPADA+DMAc ); after the addition, react at 20°C for 12h to obtain light yellow polyamic acid glue;

[0034] 3) Apply the prepared polyamic acid glue solution evenly on a clean glass plate through a film applicator, and then place the glass plate in an oven to bake the f...

Embodiment 2

[0036] 1) Clean all the glass instruments used in the experiment and dry them for later use. Add 0.0243g (0.25mmol) 4-aminophenyl-3,5 -Diethyl-4-aminophenyl-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-phosphorylethane (ADADOPPE) and 1.0699g (4.75mmol) 2-(4- Aminophenyl)-5-aminobenzoxazole (AAPBO), then add 14.8g N, N-dimethylacetamide (DMAc) solvent, stir at room temperature until ADADOPPE and AAPBO are all dissolved; The temperature is maintained at 20°C;

[0037]2) After the dissolution is completed, quickly add 2.6024g (5mmol) bisphenol A diether dianhydride (BPADA) into the three-necked flask, and the total solid content is 20% (the total solid content is m ADADOPPE+AAPBO+BPADA / m ADADOPPE+AAPBO+BPADA+DMAc ); after the addition, react at 20°C for 12h to obtain light yellow polyamic acid glue;

[0038] 3) Apply the prepared polyamic acid glue solution evenly on a clean glass plate through a film applicator, and then place the glass plate in an oven to bake the film by p...

Embodiment 3

[0040] 1) Clean all the glass instruments used in the experiment and dry them for later use. Add 0.0362g (0.375mmol) 4-aminophenyl-3,5 -Diethyl-4-aminophenyl-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-phosphorylethane (ADADOPPE) and 1.0417g (4.625mmol) 2-(4- Aminophenyl)-5-aminobenzoxazole (AAPBO), then add 14.8g N, N-dimethylacetamide (DMAc) solvent, stir at room temperature until ADADOPPE and AAPBO are all dissolved; The temperature is maintained at 20°C;

[0041] 2) After the dissolution is completed, quickly add 2.6024g (5mmol) bisphenol A diether dianhydride (BPADA) into the three-necked flask, and the total solid content is 20% (the total solid content is m ADADOPPE+AAPBO+BPADA / m ADADOPPE+AAPBO+BPADA+DMAc ); after the addition, react at 20°C for 12h to obtain light yellow polyamic acid glue;

[0042] 3) Apply the prepared polyamic acid glue solution evenly on a clean glass plate through a film applicator, and then place the glass plate in an oven to bake the film b...

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Abstract

The invention discloses a high-fire-resistance high-transparency polyimide film and a preparation method thereof. The preparation method comprises the following steps: (1) dissolving 4-aminophenyl-3,5-diethyl-4-aminophenyl-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-phosphoryl ethane and 2-(4-aminophenyl)-5-aminobenzoxazole in a polar solvent, and stirring until completely dissolving, thus obtaining a mixed solution; (2) adding BPADA (Bisphenol A type Diether Dianhydride) in the mixed solution, and keeping the temperature of a reaction system until completely reacting, thus obtaining a polyamide acid glue solution; (3) uniformly coating a plate mold with the polyamide acid glue solution, heating for thermal imidization through a program, and after completing of a heating program ,demolding after cooling to a room temperature, thus obtaining the high-fire-resistance high-transparency polyimide film. In the high-fire-resistance high-transparency polyimide film disclosed by the invention, conjugative effect is reduced by introducing a noncoplanar structure, so that the transparency is increased.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a highly flame-retardant and highly transparent polyimide film and a preparation method thereof. Background technique [0002] With the rapid development of optoelectronic display technology, light weight, large size, ultra-thin and flexible displays have become an inevitable trend in future development. Replacing the traditional hard glass with a transparent polymer film as the substrate material is the technical key to realize the flexibility of the display device. Polyimide material has become the focus of attention due to its excellent heat resistance stability and can withstand high temperature processes such as electrode film deposition and annealing treatment in the process of optoelectronic device processing. [0003] However, due to the presence of conjugated aromatic ring structures on the main chain of traditional aromatic polyimides, it is easy to form intr...

Claims

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Application Information

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IPC IPC(8): C08G73/10C08J5/18C08L79/08
CPCC08G73/1028C08G73/1085C08J5/18C08J2379/08
Inventor 胡思前汪聪茜陈薇陈妤红刘继延尤庆亮
Owner HUBEI DINGLONG CO LTD
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