CPU cooling method and apparatus

一种散热方法、散热装置的技术，应用在通过传导传热进行修饰、冷却/通风/加热改造、仪器等方向，能够解决散热罩沸腾性能不够好、降低芯片核温、增加沸腾面积和汽化核心等问题

CN107168493AInactive Publication Date: 2017-09-15SUGON DATAENERGYBEIJING CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Publication Date
2017-09-15
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a CPU cooling method and apparatus. The CPU cooling method comprises the steps of uniformly adhering metal powder to the surface of a metal sheet; in a hydrogen environment, performing sintering processing on the metal sheet to form a porous metal coverage layer on the surface of the metal sheet; and welding the metal sheet on the surface of a heat pipe. According to the method and the apparatus, the metal powder is uniformly adhered to the surface of the metal sheet, then in the hydrogen environment, the metal sheet is subjected to the sintering processing to form the porous metal coverage layer on the surface of the metal sheet, and the metal sheet is welded on the surface of the heat pipe; the heat pipe is mounted on the surface of a CPU chip, and the surface of heat pipe is subjected to sintering and enhanced boiling processing, so that a temperature field of the boiling surface is uniform, and the boiling area and the evaporation core are enlarged; and enhanced boiling heat transfer is performed, so that the core temperature of the chip is reduced.
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Description

technical field

[0001] The invention relates to the field of computer processing, in particular to a CPU cooling method and device. Background technique

[0002] Most common computers rely on cold air to cool down the machine, and water cooling or liquid cooling has two advantages: one is that it directs the coolant to the heat source instead of indirect cooling like air cooling; the other is that compared with air cooling, each unit The heat transported by the volume, that is, the heat dissipation efficiency is as high as 3500 times. Water-cooled radiators appeared in the market around 2008. Server giants such as HP and IBM and other companies focusing on data center technology have successively launched water-cooled heat dissipation products.

[0003] Evaporative cooling uses the latent heat of vaporization when the fluid boils to remove heat from the thermal principle. This cooling method using the latent heat of vaporization when the fluid boils is called "evaporative ...

Examples

Embodiment Construction

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments of the present invention belong to the protection scope of the present invention.

[0028] In order to better understand the present invention, common words in this field are introduced below.

[0029] Sintering refers to the transformation of powdery materials into dense bodies. After the powder is shaped, the dense body obtained by sintering is a polycrystalline material, and its microstructure is composed of crystals, glass bodies and pores. At the same time, the sintering process directly affects the grain size, pore size, and grain boundary shape and distribution in the...