CPU cooling method and apparatus

Abstract

The invention discloses a CPU cooling method and apparatus. The CPU cooling method comprises the steps of uniformly adhering metal powder to the surface of a metal sheet; in a hydrogen environment, performing sintering processing on the metal sheet to form a porous metal coverage layer on the surface of the metal sheet; and welding the metal sheet on the surface of a heat pipe. According to the method and the apparatus, the metal powder is uniformly adhered to the surface of the metal sheet, then in the hydrogen environment, the metal sheet is subjected to the sintering processing to form the porous metal coverage layer on the surface of the metal sheet, and the metal sheet is welded on the surface of the heat pipe; the heat pipe is mounted on the surface of a CPU chip, and the surface of heat pipe is subjected to sintering and enhanced boiling processing, so that a temperature field of the boiling surface is uniform, and the boiling area and the evaporation core are enlarged; and enhanced boiling heat transfer is performed, so that the core temperature of the chip is reduced.

Description

technical field [0001] The invention relates to the field of computer processing, in particular to a CPU cooling method and device. Background technique [0002] Most common computers rely on cold air to cool down the machine, and water cooling or liquid cooling has two advantages: one is that it directs the coolant to the heat source instead of indirect cooling like air cooling; the other is that compared with air cooling, each unit The heat transported by the volume, that is, the heat dissipation efficiency is as high as 3500 times. Water-cooled radiators appeared in the market around 2008. Server giants such as HP and IBM and other companies focusing on data center technology have successively launched water-cooled heat dissipation products. [0003] Evaporative cooling uses the latent heat of vaporization when the fluid boils to remove heat from the thermal principle. This cooling method using the latent heat of vaporization when the fluid boils is called "evaporative ...

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Problems solved by technology

[0007] Aiming at the problems in the related art, the present invention proposes a CPU heat dissipation method and device, which installs the heat pipe directly above the CPU chip, and at the same time performs sintering and enhanced boiling treatment on the surface of the heat pipe, so that the temperature field of the boiling surface is uniform , increase the boiling area and vaporization core, strengthen the boiling heat transfer, and reduce the core temperature of the chip, thus solving the problem that the boiling performance of the existing smooth cooling cover is not good enough

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