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Ceramic housing for area array charge-coupled device packaging and manufacturing method thereof

A technology of charge-coupled devices and ceramic shells, which is applied in the direction of electric solid-state devices, semiconductor/solid-state device manufacturing, electrical components, etc., can solve the problems of low flatness and high air-tightness, and achieve the goal of improving flatness and air-tightness Effect

Active Publication Date: 2020-08-18
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a ceramic shell for area array charge-coupled device packaging and its manufacturing method. The ceramic shell made by this method has high flatness and high air tightness, and can solve the problem of low flatness

Method used

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  • Ceramic housing for area array charge-coupled device packaging and manufacturing method thereof
  • Ceramic housing for area array charge-coupled device packaging and manufacturing method thereof
  • Ceramic housing for area array charge-coupled device packaging and manufacturing method thereof

Examples

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Embodiment 1

[0029] A kind of ceramic housing for the packaging of area array charge-coupled devices provided by Embodiment 1 of the present invention, see figure 1 , figure 2 , image 3 As shown, this embodiment is a schematic structural diagram when the chip mounting area and the sealing surface 4 are coplanar, including the ceramic part 1 and the needle lead wire 2, and the chip mounting area 3 and the sealing surface 4 on the front of the ceramic part 1 are all polished and polished. After processing, grinding and polishing, the flatness of the sealing surface 4 of the ceramic part 1 and the chip mounting area 3 is ≤1 μm / mm or 50 μm.

[0030] Wherein, the sealing surface 4 of the ceramic part 1 is ground and polished by a polishing machine or an abrasive tool. When the chip mounting area 3 is coplanar with the sealing surface 4, the grinding and polishing method of the chip mounting area 3 is the same as that of the sealing surface 4. When coplanar, it is preferable to use a polishi...

Embodiment 2

[0037] Embodiment 2 of the present invention provides a ceramic case for encapsulating an area-array charge-coupled device, see Figure 4 , Figure 5 , Figure 6 shown, from Figure 4 It can be seen from the figure that the chip mounting area 3 is embedded in the ceramic part, that is, the chip mounting area 3 and the sealing surface 4 are not in the same plane. Polish the corners of the chip mounting area. Except for this, all the other technical solutions adopted are the same as those in Example 1.

[0038] The present invention also provides a method for manufacturing a ceramic shell for area array charge-coupled device packaging, including the following processes: casting, blanking, punching, hole filling, printing, lamination, hot cutting, sintering, grinding and polishing, nickel plating , brazing, gold plating. The grinding and polishing process is to use a polishing machine or abrasive tool to grind and polish the front sealing surface, chip mounting area and back...

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Abstract

The invention discloses a ceramic shell for packaging an area-array charge couple device and a manufacturing method for the ceramic shell, and relates to the technical field of a ceramic packaging shell. The ceramic shell comprises a ceramic part and pin leads; a chip mounting region and sealing surfaces on the front surface of the ceramic part are both processed by adopting a grinding and polishing manner; and the flatness of the sealing surface and the chip mounting region of the grinded and polished ceramic part are both less than or equal to 1[mu]m / mm or 50[mu]m. The ceramic shell manufactured by the method is high in flatness and airtightness, and can solve the problem of low flatness.

Description

technical field [0001] The invention relates to the technical field of ceramic packaging shells, in particular to a ceramic shell for area array charge-coupled device packaging and a manufacturing method thereof. Background technique [0002] Conventional CPGA (Ceramic Pin Grid Array, ceramic pin grid array, a chip packaging form) ceramic shell is composed of ceramic parts, pin leads and metal sealing ring (optional), among which ceramic parts are made of multilayer alumina ceramic tungsten Metallized high-temperature co-firing process, one-time molding, no post-processing, and then ceramic parts and needle leads are assembled and welded with silver-copper solder. [0003] The ceramic shell for area charge coupled device (CCD) packaging is in the form of CPGA structure, which is composed of ceramic parts and pin leads. The ceramic part material is 90% alumina, and the pin lead material is iron nickel. alloy or iron-nickel-cobalt alloy. Since the area array CCD packaging sh...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48H01L27/146H01L27/148
CPCH01L21/4807H01L27/14618H01L27/14806
Inventor 张倩彭博
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP