Ultrathin three-dimensional water-cooling device and machining method thereof

A technology of a water-cooling device and a processing method, which is applied to lighting and heating equipment, heat exchanger fixing, heat exchange equipment, etc. Weight, reducing radiation heat dissipation, good heat exchange effect

Pending Publication Date: 2017-10-03
吴丹 +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0017] In order to solve the lack of integrally formed three-dimensional water-cooling devices in the prior art, multiple plane water-cooling plates are usually spliced ​​together in the pr

Method used

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  • Ultrathin three-dimensional water-cooling device and machining method thereof
  • Ultrathin three-dimensional water-cooling device and machining method thereof
  • Ultrathin three-dimensional water-cooling device and machining method thereof

Examples

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Example Embodiment

[0072] Implementation mode one:

[0073] Combine Figure 3-7 To illustrate this embodiment, an ultra-thin three-dimensional water-cooling device of this embodiment is processed by a water-cooling plate into a solid shape. The thickness of the water-cooling plate is 0.5mm-3.5mm. The water-cooling plate is composed of two plates superimposed on each other. The fixed connection is achieved by diffusion welding, in which at least one plate has a water flow channel etched on the side wall, the water flow channel is located between the two plates, and any one of the two plates is provided with an inlet with the water flow channel. The water inlet and outlet corresponding to the water end and the water outlet.

[0074] In this embodiment, a water flow channel is etched on the side wall of one plate and the other plate is a flat plate, such as image 3 As shown; it is also necessary to etch the water flow channels on the side walls of the two plates, and then buckle the two plates with the...

Example Embodiment

[0099] Implementation mode two

[0100] Combine Figure 8-14 To illustrate this embodiment, an ultra-thin three-dimensional water-cooling device of this embodiment is formed by bending a water-cooling plate into a solid shape. The thickness of the water-cooling plate is 0.5mm-3.5mm. The water-cooling plate is composed of three plates. It is superimposed and fixedly connected by diffusion welding. The middle plate is provided with a hollow water flow channel, and any one of the plates on both sides is provided with an inlet corresponding to the water inlet and the water outlet of the water flow channel. Nozzle and outlet.

[0101] The hollow water flow channel in this embodiment can be formed by wire cutting, laser cutting, or plasma cutting. The wire cutting is better because the wire cutting method has a higher dimensional accuracy, which can be as high as 0.02mm, and no waste is generated on the surface of the cut. , The plate deformation is small.

[0102] The thickness of the w...

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Abstract

The invention discloses an ultrathin three-dimensional water-cooling device and a machining method thereof, and belongs to the field of water-cooling plate machining. The ultrathin three-dimensional water-cooling device provided by the invention is machined into a three-dimensional shape from a water-cooling plate, the thickness of the water-cooling plate is 0.5mm-3.5mm, and the width of a part vertical to the plate surface of the water-cooling plate, of a water flow flowing channel, is 50%-70% of the thickness of the water-cooling plate. The water-cooling device can be machined into an integrated spatial three-dimensional structure with any size as needed; and moreover, the machined three-dimensional shape is unlimited, a leakage point at a turning point/bending part is avoided, and non-uniform local heat dissipation due to the heat leakage point is avoided. The water-cooling device is applicable to heat dissipation for a component.

Description

technical field [0001] The invention relates to an ultra-thin three-dimensional water cooling device and a processing method thereof, belonging to the field of water cooling plate processing. Background technique [0002] In the prior art, most of the heat dissipation in the plane is used, there are few three-dimensional heat dissipation structures, and the efficiency of the plane heat dissipation is low. In some cases, the plane heat dissipation cannot meet the heat dissipation requirements, and the space heat dissipation can greatly improve the heat dissipation efficiency and achieve the purpose of rapid heat dissipation. is a research focus in this field. [0003] There are generally three methods to solve the problem of heat dissipation at high temperature: 1. Water cooling method, 2. Air cooling method, 3. The method of using heat insulation materials, among which: [0004] 1. Water cooling method [0005] The conventional water cooling method is in the form of a flat...

Claims

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Application Information

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IPC IPC(8): F28D9/00F28F3/00F28F3/08
CPCF28D9/00F28F3/00F28F3/08F28F2255/00F28F2275/061
Inventor 吴丹李兆红王楠楠
Owner 吴丹
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