Pressure formation plate and preparation method therefor

Abstract

The invention discloses a pressure formation plate and a preparation method therefor. An upper side copper plate is laminated on the upper surface of the substrate of the pressure formation plate while a lower side copper plate is laminated on the lower surface of the substrate; the thicknesses of the upper side copper plate and the lower side copper plate are greater than 0.2mm; positive electrode current sheets, positive electrode voltage sheets, negative electrode current sheets and negative electrode voltage sheets are curved on the upper side copper plate; the upper surface of each current sheet and each voltage sheet is a drawbench rough surface; lower side current connecting sheets and lower side voltage connecting sheets are curved on the lower side copper plate; the positive electrode current sheets and the lower side current connecting sheets are connected through current conductive columns; and the positive electrode voltage sheets and the lower side voltage connecting sheets are connected through voltage conductive columns. The pressure formation plate is high in conductivity, stable and reliable in contact, high in flatness, and capable of effectively improving the yield in formation and capacity grading as well as realizing batch production; and the preparation method comprises the following steps of cutting, copper plate pressing, curving, hole drilling, conductive column processing, conductive column inserting, welding, insulating plate lamination, surface flower-pattern curving, and solder mask layer vulcanization.

Description

technical field [0001] The invention relates to the technical field of formation and capacity of power soft pack lithium batteries, in particular to a pressure formation plate and a preparation method thereof. Background technique [0002] The power soft pack lithium battery has a large discharge coefficient. Because of the low copper thickness of ordinary circuit boards (because the circuit board production process cannot be produced when the copper thickness exceeds 0.15mm), the copper thickness in the via hole is not enough due to the limitation of the electroplating process. Through a current of more than 20A, the surface of the circuit board is not rough enough to effectively pierce the oxide insulating film on the surface of the aluminum tab of the lithium battery, which easily leads to poor contact. [0003] In addition, the use of metal and copper parts cannot be used in mass production because of the difficulty in processing, high production costs, low flatness, and...

AI Technical Summary

Problems solved by technology

[0002] The power soft pack lithium battery has a large discharge coefficient. Because of the low copper thickness of ordinary circuit boards (because the circuit board production process cannot be produced when the copper thickness exceeds 0.15mm), the copper thickness in the via hole is not enough due to the limitation of the electroplating process. Through a current of more than 20A, the surface of the circuit board is not rough enough to effectively pierce the oxide insulating film on the surface of the aluminum tab of the lithium battery, which easily leads to poor contact.

[0003] In addition, the use of metal and copper parts cannot be used in mass production because of the difficulty in processing, high production costs, low flatness, and poor contact, which limits the production rate of the composition and capacity of power soft pack lithium batteries, and Leading to a large number of scrapped power soft pack lithium batteries in the production process

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