High temperature characteristic test method and device for semiconductor device heated by current

A technology of high-temperature characteristics and testing methods, which is applied in the direction of single semiconductor device testing, measuring devices, instruments, etc., can solve the problems of high cost of heating devices, low testing accuracy, and long testing time, and achieve fast heating speed and high testing accuracy , Test the effect of small time-consuming

CN107271878AActive Publication Date: 2017-10-20山东阅芯电子科技有限公司
5 Cites 13 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Publication Date
2017-10-20

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention relates to a high temperature characteristic test method and a device for a semiconductor device heated by current. When the circuit formed when a power supply and a to-be-tested semiconductor device are electrically connected is conducted, conduction current exists in the to-be-tested semiconductor device, loss of the semiconductor device itself can be used to heat a semiconductor chip, and the heating speed is quick; during the heating process, a TSP parameter of the semiconductor device is monitored timely, the TSP parameter is used to calculate the junction temperature of the to-be-tested semiconductor device, once the junction temperature is enough close to the test target temperature Tj-test, the high temperature characteristic test system is used to realize a high temperature characteristic test on the to-be-tested semiconductor device. The time consumed for test is little, the efficiency is high, and the method and the device are extremely suitable for test on a large number of samples; the test precision is high; and no scalding possibility exists during the operation process, and the test safety is improved.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to a testing method and device, in particular to a high-temperature characteristic testing method and device for heating a semiconductor device by electric current, belonging to the technical field of semiconductor high-temperature characteristic testing. Background technique

[0002] Semiconductor devices based on semiconductor materials such as silicon, germanium or gallium arsenide can be used as rectifiers, oscillators, light emitters, amplifiers, photometers and other equipment. To distinguish them from integrated circuits, they are sometimes called discrete devices. Specifically include diodes, bipolar transistors, field effect transistors, photodetectors, light emitting diodes, semiconductor lasers and photocells and other devices.

[0003] The characteristics of the parameters and performance of semiconductor devices under different temperature conditions. Specifically, it includes normal temperature (25°C) characteristi...

Examples

Embodiment Construction

[0043] The present invention will be further described below in conjunction with specific drawings and embodiments.

[0044] Such as image 3 and Figure 4 Shown: in order to improve test efficiency and test precision, ensure the safety of test, the high-temperature characteristic test method of the present invention comprises the following steps:

[0045] Step 1, providing a semiconductor device to be tested, a power supply 9 for injecting heating current into the semiconductor device, a junction temperature testing system 8 for testing the junction temperature of the semiconductor device to be tested, and a high temperature characteristic for testing the high temperature characteristic of the semiconductor device A test system 1, the semiconductor device can be adapted and connected to the high temperature characteristic test system 1, the junction temperature test system 8 and the power supply 9;

[0046] Specifically, the semiconductor device to be tested has a device ho...