Vulcanization-resisting TFT-LCD packaging silica gel with high refraction index

Abstract

The invention discloses a vulcanization-resisting TFT-LCD packaging silica gel with a high refraction index. The TFT-LCD packaging silica gel is composed of the following raw materials in parts by weight: 72-84 parts of methyl phenyl vinyl silicone resin, 36-44 parts of vinyl resin, 18-22 parts of chain extender hydrodiphenyl polysiloxane, 30-40 parts of polysiloxane A, 28-34 parts of polysiloxane B, 8-18 parts of organosilicone with cycloolefin structure, 3-6 parts of platinum catalyst, 4-7 parts of adhesive, 3-5 parts of cross-linking agent, 2-4 parts of inhibitor, 3-5 parts of surface modified nanometer diamond, 2-3 parts of curing accelerator and 3-5 parts of curing inhibitor. Compared with the prior art, the TFT-LCD packaging silica gel disclosed by the invention has an excellent optical structure and high refraction index and has the advantages of high vulcanization resistance, excellent sealing property and anti-aging property, excellent weather fastness, yellowing resistance, easiness in de-foaming, convenience in operation, and the like.

Description

technical field [0001] The invention relates to the technical field of encapsulating silica gel, in particular to a high-refractive-index vulcanization-resistant TFT-LCD encapsulating silica gel. Background technique [0002] The rise of the LED industry has brought new hope to energy conservation, emission reduction, and energy environmental protection, showing an extremely broad application prospect. With the rapid development of the LED industry, especially the lighting industry, LED is gradually developing towards high power, so more and more comprehensive requirements are put forward for packaging materials. High-refractive index LED packaging silica gel has become an important packaging material because of its small internal stress, good aging resistance, high and low temperature resistance, and high luminous flux, and is widely used in the field of LED packaging. [0003] With the development of industry, the sulfur content in the air is increasing day by day. If the...

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Problems solved by technology

Therefore, in the formula design, methods such as increasing the content of phenyl silicone resin and increasing the crosslinking density are used to improve the vulcanization resistance. Although such a design improves the vulcanization resistance, the internal stress of the packaging material is too high, which will lead to a decrease in the toughness of the material. The reaction is in After encapsulation, high and low temperature cold and heat impact dead lights, and the encapsulation material is easy to crack after high and low temperature.

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