High-temperature-resistant, high-toughness and sulfuration-resistant AMOLED packaging silica gel

Abstract

The invention discloses a high-temperature-resistant, high-toughness and sulfuration-resistant AMOLED packaging silica gel prepared from the following raw materials in parts by weight: 35-44 parts ofhydrogen-terminated silicone resin, 26-32 parts of vinyl resin, 15-26 parts of polymethylphenylsiloxane, 7-11 parts of dimethyl polysiloxane monomers, 7-14 parts of divinyltetramethyldisiloxane, 6-12parts of tetrabutyl ammonium hydroxide, 3-6 parts of catalyst, 4-7 parts of binder, 3-5 parts of crosslinking agent, 2-4 parts of inhibitor, 2-3 parts of curing accelerator and 3-5 parts of curing inhibitor. Compared with the prior art, the high-temperature-resistant, high-toughness and sulfuration-resistant AMOLED packaging silica gel has the beneficial effects that the AMOLED packaging silica gel is strong in sulfuration resistance, good in sealing performance and high temperature resistance, good in weather resistance, yellowing-resistant and easy to defoam and further has the advantages such as high toughness and convenience in operation in addition to excellent optical structure and high refractive index.

Description

Technical field [0001] The invention relates to the technical field of encapsulating silica gel, in particular to a vulcanization resistant AMOLED encapsulating silica gel with high temperature resistance and high toughness. Background technique [0002] The rise of the LED industry has brought new hopes for energy conservation, emission reduction, and environmental protection, and has demonstrated extremely broad application prospects. With the rapid development of the LED industry, especially the lighting industry, LEDs are gradually developing in the direction of high power, so more and more comprehensive requirements are put forward for packaging materials. High refractive index LED packaging silica gel has become an important packaging material because of its low internal stress, good aging resistance, high and low temperature resistance, and high luminous flux, and is widely used in the field of LED packaging. [0003] With the development of industry, the sulfur content in ...

AI Technical Summary

Problems solved by technology

Therefore, in the formula design, methods such as increasing the content of phenyl silicone resin and increasing the crosslinking density are used to improve the vulcanization resistance. Although such a design improves the vulcanization resistance, the internal stress of the packaging material is too high, which will lead to a decrease in the toughness of the material. The reaction is in After encapsulation, high and low temperature cold and heat impact dead lights, and the encapsulation material is easy to crack after high and low temperature.