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Forming treatment method for TFT-LCD copper-etching solution

A processing method, copper etching technology, applied in the field of TFT-LCD, can solve the problem of unstable etching performance, achieve the effect of improving etching quality, improving uniformity, and avoiding waste of resources

Inactive Publication Date: 2017-10-24
HEFEI HUIKE PRECISION DIE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the actual etching process, most etching solutions will have a stage of unstable etching performance in the early stage of the trial period

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0015] Embodiment A kind of generation treatment method that is used for TFT-LCD copper etchant, comprises the following steps:

[0016] (1) generate copper etching solution additive, described copper etching solution additive is solvent with deionized water, is electric neutrality, copper etching solution additive is added in copper etching solution, divalent copper content is 130- in the adjustment etching solution 150g / L;

[0017] (2) Adjust the pH to 2.0-3.0, add aluminum 60-80g / L to react, and the temperature is 75-85°C. During the reaction, air is introduced to react until the copper content in the solution is lower than 10g / L. After the reaction, it precipitates into electrons Grade copper powder, the solution is polyaluminum chloride flocculant;

[0018] (3) Let the solution obtained above stand for 25-35min, filter, and add appropriate amount of aluminum and 5-6g / L hydrogen peroxide to the filtrate to react, control the temperature at 60-85°C, and pass air during the...

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PUM

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Abstract

The invention discloses a forming treatment method for a TFT-LCD copper-etching solution. The forming treatment method comprises the following steps that a copper-etching solution additive is formed, and is added to a copper-etching solution, and the content of divalent copper in the copper-etching solution is adjusted to be 130-150g / L; (2) the pH is adjusted to 2.0-3.0, 60-80g / L of aluminum is added for reaction, air is supplied in a reaction process, the reaction is carried out till the copper content in the solution is lower than 10g / L, sediments after the reaction are electronic-grade copper powder, and a solution is a polyaluminium chloride flocculant; (3) the solution obtained in the step (2) stands for 25-35min, and is filtered, an appropriate amount of aluminum and 5-6g / L of hydrogen peroxide are added to a filtrate for reaction, the temperature is controlled at 60-85 DEG C, the air is supplied in a reaction process, and after the reaction, filtration is carried out, sediments are electronic-grade copper powder, and a solution is a polyaluminium chloride flocculant; and (4) the copper powder obtained by filtration in the previous steps is washed with deionized water and distilled water for 2-3 times and centrifugal dewatering is carried out till the chlorine content is 0.3mg / L, and roasting is carried out, thus electronic-grade copper oxide is obtained.

Description

technical field [0001] The invention relates to the technical field of TFT-LCD, in particular to a generation and treatment method for TFT-LCD copper etching solution. Background technique [0002] The production process of LCD panels includes cleaning-film formation-exposure-development-etching-stripping-inspection. Among them, the film forming method includes physical vapor deposition and chemical vapor deposition, and the etching method includes wet etching and dry etching. Among them, the effect of wet etching has a great influence on the fineness of wiring and the quality of the final panel. In the past, the metal wiring of the liquid crystal display device is mostly made of aluminum or aluminum alloy, and the etching solution system is generally a mixture of inorganic acids. With the development of display technology, especially the development of display technology towards large-scale and high-resolution, traditional metal wires will increase with the length of the ...

Claims

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Application Information

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IPC IPC(8): C23F1/18
CPCC23F1/18
Inventor 白航空
Owner HEFEI HUIKE PRECISION DIE CO LTD