Single chip integrated acoustic surface wave filter component

Abstract

The invention relates to a single chip integrated acoustic surface wave filter component. The single chip integrated acoustic surface wave filter component comprises a silicon single crystal substrate, an acoustic surface wave filter unit arranged on the piezoelectric film region on the top of the silicon single crystal substrate, multiple groups of metal beams used for gating the filter unit and fixed electrodes thereof, an input signal total electrode, an output signal total electrode, a metal beam pull-down electrode and a pull-down signal input electrode of a control metal beam arranged at the back of the silicon single crystal substrate, and a pull-down signal input line. According to the invention, the interconnection structures are gated by the filter unit adopting the on-chip integration, and a micro mechanical switch with excellent dynamic and static characteristics is used as a gating switch element, therefore, the single chip integrated acoustic surface wave filter component has the advantages of compact structure, small radio frequency loss and good filter channel isolation.

Description

technical field [0001] The invention relates to an integrated surface acoustic wave device, in particular to a monolithic integrated surface acoustic wave filter component, belonging to the technical field of microelectronics. Background technique [0002] The surface acoustic wave filter converts the electrical signal into an acoustic signal by the input interdigital transducer fabricated on the piezoelectric substrate, the acoustic signal propagates along the surface of the substrate, and then converts the acoustic signal into an electrical signal by the output interdigital transducer , in the two conversions, the filtering function of the electrical signal is realized, that is, the electrical signal of a certain frequency band is allowed to pass and the electrical signal of other frequencies is suppressed. [0003] The surface acoustic wave filter component includes multiple surface acoustic wave filter units and their gating circuits, which can realize one or more inputs...

AI Technical Summary

Problems solved by technology

[0005] In the prior art and application of the surface acoustic wave filter components, the filter unit is an independent device in a discrete package, that is, each surface acoustic wave filter chip is placed in an independent package, and multiple discrete filter units and The corresponding switch gating circuit is assembled on the component substrate. The disadvantages brought about by this are that the on-chip and off-chip gating interconnection structure of the filter component is relatively complicated, and the high-frequency coupling between channels on the component substrate is relatively serious, which affects the channel. The isolation characteristics, and the overall component has a large volume and weight, which does not meet the requirements of miniaturization and portability of electronic devices and systems

The filter unit gating circuit configured outside the chip generally uses semiconductor switching elements such as high-frequency PIN diodes as the gating switch, and its inherent on-state resistance, reverse current and parasitic parameters reduce the switching performance of the filter unit gating circuit

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