Remotely coated fluorescent powder plate and preparation method thereof

A phosphor and yellow phosphor technology, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as affecting the excitation efficiency of phosphors, weakening the luminous efficiency, reducing the photoelectric index of the light source, and achieving high hardness and good shape retention. , the effect of good photoelectric index

Inactive Publication Date: 2017-12-01
ZHONGSHAN INST OF MODERN IND TECH SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Most of the LED lamps on the market now use COB light sources. Traditional COB light sources are tightly combined with chips and phosphors. The photoelectric index of the light source is a major limitation for the development of COB packaging

Method used

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  • Remotely coated fluorescent powder plate and preparation method thereof
  • Remotely coated fluorescent powder plate and preparation method thereof
  • Remotely coated fluorescent powder plate and preparation method thereof

Examples

Experimental program
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Embodiment 1

[0033] Design a 25W integrated lamp, as follows:

[0034] The LED light source adopts blue light chip, the single optical power is between 440-480mw (350mA), it adopts the form of 5 parallel 15 strings, the total input voltage is 45V, and the total input current is 0.55A, so the power of the whole LED module is 24.75W .

[0035] 1. The preparation of the phosphor sheet comprises the following steps:

[0036] (1) Mold design and production: According to the structure of the dispenser, design and manufacture a glass mold with grooves and positioning through holes that matches the dispenser;

[0037] Such as figure 1 Shown is the schematic diagram of the glass mold made. The length of the glass mold is 150cm, the width is 80cm, and the thickness is 2cm; there are four grooves and eight positioning through holes on the glass mold; wherein, the diameter of the groove is 60mm, and the depth is 2mm, and the diameter of the positioning through hole is 2.5mm;

[0038] (2) Preparati...

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Abstract

The invention discloses a remotely coated fluorescent powder plate and a preparation method thereof. The preparation method comprises the steps of 1, design and manufacturing of a mold: designing and manufacturing a glass mold provided with a groove and a positioning through hole and matched with a dispensing device; 2, deploying and dispensing of fluorescent colloid: mixing fluorescent powder with silica gel, then stirring uniformly, and defoaming to acquire the fluorescent colloid; uniformly spraying a releasing agent to the inner wall and the bottom of the groove of the glass mold, and then dispensing the colloid; 3, solidification: after colloid is dispensed, standing horizontally, and after the colloid flows flat, placing the glass mold into an oven for baking so as to solidify the fluorescent colloid in the groove; and 4, demolding: scraping the solidified fluorescent colloid away from the inner wall of the groove to acquire the remotely coated fluorescent powder plate. According to the preparation method provided by the invention, the silica gel with rigidity of Shore hardness D40 which is higher than the rigidity of common COB packaging silica gel, so that the prepared remotely coated fluorescent powder plate is prone to shape and demold, good in shape retentivity, and is applicable to integrated lamps, with good photoelectric index.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to a remote-coated fluorescent powder sheet and a preparation method thereof. Background technique [0002] Most of the LED lamps on the market now use COB light sources. Traditional COB light sources are tightly combined with chips and phosphors. The photoelectric index of the light source is a major limitation in the development of COB packaging. Therefore, the concept of remote coating was born, that is, the LED chip and the phosphor powder are separated and packaged, so as to reduce the influence of the heat generation of the chip itself on the phosphor powder, so that the phosphor powder can be better excited and improve the light extraction efficiency. Under such circumstances, as the core part of remote coating, the preparation method of phosphor sheet is particularly important. [0003] The invention aims to design a fluorescent powder sheet to match an integrated la...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L33/48H01L33/50
CPCH01L33/005H01L33/48H01L33/504
Inventor 王洪张景葛鹏贺军
Owner ZHONGSHAN INST OF MODERN IND TECH SOUTH CHINA UNIV OF TECH
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