Single-crystal bar disconnection cutting equipment

Abstract

The invention discloses single-crystal bar disconnection cutting equipment. The single-crystal bar disconnection cutting equipment comprises a machine frame, a single-crystal bar feeding device, a cutting machine frame, a wire saw cutting mechanism, a single-crystal bar jacking device, a material collecting and conveying robot and a skip car, wherein the single-crystal bar feeding device can slide on an undercarriage for operation; the cutting machine frame is installed on the undercarriage; the wire saw cutting mechanism is installed on the cutting machine frame; and the single-crystal bar jacking device, the material collecting and conveying robot and the skip car can slide on the undercarriage. The single-crystal bar disconnection cutting equipment is characterized in that supporting roller assemblies are fixed to a base; clamping jaws of two movable clamping units are located above supporting rollers, and the clamping units can penetrate through the space below the cutting machine frame; the wire saw cutting mechanism achieves single-section cutting; servo motors drive speed reducers to drive gears to be engaged with racks so that a bar flotation jacking device can move; and the material collecting robot is located on the side face of the bar flotation jacking device. The single-crystal bar disconnection cutting equipment has the advantages that the clamping units and the single-crystal bar jacking device can be driven to move automatically through matching of the motors, the gears and the racks, the labor intensity of operators is low and the degree of automation is high; and diamond wires can be replaced conveniently, wire breaking cannot happen easily and the failure rate is low.

Description

technical field [0001] The invention belongs to the technical field of cutting hard and brittle materials, in particular to a diamond wire saw cutting device. Background technique [0002] In the Chinese patent literature, the name of the publication number CN201620055181.2 is a monocrystalline silicon cutting machine (see the specific implementation section of the application specification), which discloses a diamond wire that uses a high-speed reciprocating operation to pass through the wire-feeding mechanism of the equipment. It is a single crystal silicon cutting machine that processes and grinds silicon anchors, and finally realizes cutting and segmentation. [0003] shortcoming: [0004] 1. Use a high-speed reciprocating long diamond wire to process and grind the silicon anchor through the wire feeding mechanism of the equipment; the cutting wire not only needs to be retracted and unwound, but also needs to be arranged according to a certain pitch. The elongation of ...

AI Technical Summary

Problems solved by technology

[0004] 1. Use a high-speed reciprocating long diamond wire to process and grind the silicon anchor through the wire feeding mechanism of the equipment; the cutting wire not only needs to be retracted and unwound, but also needs to be arranged according to a certain pitch. The elongation of the cutting wire is compensated by the tension device to prevent wire breakage. The wire feeding mechanism is complicated, and the wire is easy to break. If any part breaks, the entire long wire will be scrapped, resulting in waste, and the wire breakage during the cutting process will have a great impact on the accuracy. Replace the cutting machine. wire consumption time;

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